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Electrical and Computer Engineering Faculty Research & Creative Works
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Full-Text Articles in Engineering
Investigation Of Fundamental Emi Source Mechanisms Driving Common-Mode Radiation From Printed Circuit Boards With Attached Cables, David M. Hockanson, James L. Drewniak, Todd H. Hubing, Thomas Van Doren, Fei Sha, Michael J. Wilhelm
Investigation Of Fundamental Emi Source Mechanisms Driving Common-Mode Radiation From Printed Circuit Boards With Attached Cables, David M. Hockanson, James L. Drewniak, Todd H. Hubing, Thomas Van Doren, Fei Sha, Michael J. Wilhelm
Electrical and Computer Engineering Faculty Research & Creative Works
Fundamental EMI source mechanisms leading to common-mode radiation from printed circuit boards with attached cables are presented in this paper. Two primary EMI source mechanisms have been identified: one associated with a differential-mode voltage and another associated with a differential-mode current, both of which result in a common-mode current on an attached cable. These mechanisms can be used to relate printed circuit layout geometries to EMI sources. The two mechanisms are demonstrated through numerical and experimental results, and an example from a production printed-circuit design is presented.
Simulation And Measurement For Decoupling On Multilayer Pcb Dc Power Buses, Hao Shi, F. Yuan, Fei Sha, James L. Drewniak, Todd H. Hubing, Thomas Van Doren
Simulation And Measurement For Decoupling On Multilayer Pcb Dc Power Buses, Hao Shi, F. Yuan, Fei Sha, James L. Drewniak, Todd H. Hubing, Thomas Van Doren
Electrical and Computer Engineering Faculty Research & Creative Works
DC power bus decoupling of a multi-layer PCB is modeled by a combination of a lumped circuit model at low frequencies ( < 200 MHz), and a mixed-potential integral equation approach at high frequencies. In order to determine the lumped parameters of via interconnects, an effective procedure using a network analyzer has been developed to characterize the trace/via inductances/resistances. For an 8 inch × 10 inch ten-layer test board used in this study, the simulations show good agreement with the measurement. This method can lead to new design strategies of decoupling for multilayer PCB power buses.
An Expert System Approach To Emc Modeling, Todd H. Hubing, James L. Drewniak, Thomas Van Doren, Navin Kashyap
An Expert System Approach To Emc Modeling, Todd H. Hubing, James L. Drewniak, Thomas Van Doren, Navin Kashyap
Electrical and Computer Engineering Faculty Research & Creative Works
Existing computer software for EMC analysis can be divided into three categories. Analytical modeling codes employ closed form expressions to solve problems of general interest to EMC engineers or circuit designers. Numerical modeling codes use numerical techniques to solve Maxwell's equations subject to specific boundary conditions. EMC rule checkers search a design for features that violate basic EMC design guidelines. This paper outlines the relative advantages and limitations of each of these three approaches and describes an expert system EMC modeling approach. The new approach combines analytical models, numerical models, and EMC rule-checking in order to evaluate designs in much …