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Identifying And Quantifying Printed Circuit Board Inductance, Todd H. Hubing, Thomas Van Doren, James L. Drewniak
Identifying And Quantifying Printed Circuit Board Inductance, Todd H. Hubing, Thomas Van Doren, James L. Drewniak
Electrical and Computer Engineering Faculty Research & Creative Works
The concepts of inductance and partial inductance play a key role in printed circuit board (PCB) modeling. The inductance of the signal path is an important parameter in high-speed signal integrity calculations. Delta_I noise modeling, crosstalk calculations, and common-mode source identification all rely heavily on accurate estimations of the partial inductance associated with traces, vias, and signal return paths on printed circuit boards. The paper begins by identifying and quantifying the parameters that affect the inductance of typical PCB geometries. Closed-form equations are provided for estimating the partial inductances of simple trace, via, and ground plane configurations. Finally, the issue …
Common Mode Currents Induced On Wires Attached To Multilayer Printed Wire Boards With Segmented Ground Planes, R. Lee Hill, Thomas Van Doren, Todd H. Hubing, James L. Drewniak, Franz Gisn
Common Mode Currents Induced On Wires Attached To Multilayer Printed Wire Boards With Segmented Ground Planes, R. Lee Hill, Thomas Van Doren, Todd H. Hubing, James L. Drewniak, Franz Gisn
Electrical and Computer Engineering Faculty Research & Creative Works
An investigation has been undertaken to further study the fundamental mechanisms responsible for inducing high frequency common mode currents on wires attached to multilayer printed wire boards (PWBs). Previous work reported in the EMC literature has demonstrated that the presence of unintended common mode currents on the external cables of electronic equipment is often the primary source of radiated EMI at frequencies above 30 MHz. In an attempt to reduce the magnitude of these currents to yield `quieter' electronic products, many EMC engineers have implemented segmented or `gapped' ground plane geometries in mulilayer PWB designs. The objective of this study …
The Role Of Component Packaging In System Electromagnetic Compatibility, Todd H. Hubing
The Role Of Component Packaging In System Electromagnetic Compatibility, Todd H. Hubing
Electrical and Computer Engineering Faculty Research & Creative Works
Increases in the speed and density of electronic systems do not necessarily result in tougher electromagnetic compatibility problems. In fact, recent advances in packaging technology can help designers to meet electromagnetic compatibility requirements. However, working with new technologies requires us to re-evaluate existing EMC design models and guidelines. Understanding the system-level impact of component-level packaging changes, is a prerequisite for meeting stringent electromagnetic compatibility requirements in a timely and cost-effective manner.