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Dc Power Bus Design With Fdtd Modeling Including A Dispersive Media, Xiaoning Ye, Jun Fan, Marina Koledintseva, James L. Drewniak
Dc Power Bus Design With Fdtd Modeling Including A Dispersive Media, Xiaoning Ye, Jun Fan, Marina Koledintseva, James L. Drewniak
Electrical and Computer Engineering Faculty Research & Creative Works
DC power-bus modeling in high-speed digital design using the FDTD method is reported here. The dispersive medium is approximated by a Debye model to account for the loss. A wide band frequency response (100 MHz-5 GHz) is obtained through a single FDTD simulation. Favorable agreement is achieved between the modeled and measured results for a typical DC power-bus structure with multiple SMT decoupling capacitors mounted on the board. The FDTD tool is then applied to investigate the effects of local decoupling on a DC power-bus. The modeled results agree with the results from another modeling tool, the CEMPIE (a circuit …
Fdtd And Fem/Mom Modeling Of Emi Resulting From A Trace Near A Pcb Edge, Daniel P. Berg, Motoshi Tanaka, Yun Ji, Xiaoning Ye, James L. Drewniak, Todd H. Hubing, Richard E. Dubroff, Thomas Van Doren
Fdtd And Fem/Mom Modeling Of Emi Resulting From A Trace Near A Pcb Edge, Daniel P. Berg, Motoshi Tanaka, Yun Ji, Xiaoning Ye, James L. Drewniak, Todd H. Hubing, Richard E. Dubroff, Thomas Van Doren
Electrical and Computer Engineering Faculty Research & Creative Works
PCB traces routed near board edges and carrying high-speed signals are considered to contribute to EMI problems. Consequently, design maxims state that traces that might have intentional or unintentional high frequency components on them be kept away from board edges. This costs valuable surface area as boards become more densely designed. Further, design maxims concerning traces near board edges are not well quantified. The increase in EMI as a trace is routed increasingly closer to the PCB edge has been studied experimentally and with numerical modeling.
Development Of A Closed-Form Expression For The Input Impedance Of Power-Ground Plane Structures, Minjia Xu, Yun Ji, Todd H. Hubing, Thomas Van Doren, James L. Drewniak
Development Of A Closed-Form Expression For The Input Impedance Of Power-Ground Plane Structures, Minjia Xu, Yun Ji, Todd H. Hubing, Thomas Van Doren, James L. Drewniak
Electrical and Computer Engineering Faculty Research & Creative Works
This paper analyzes the fundamental behavior of PCB power bus structures using the modal expansion method. The results are validated by experiments and full-wave numerical modeling. It is shown that the power bus can be modeled as a series LeC circuit below the first board resonance frequency. C is the interplane capacitance and Le is an effective inductance contributed by all the cavity nodes. The effects of the layer thickness, port location, board size and the feeding wire radius on the value of Le are discussed in this study. Le can be estimated from the …
Emi Resulting From A Signal Via Transition Through Dc Power Bus-Effectiveness Of Focal Smt Decoupling, Wei Cui, Xiaoning Ye, Bruce Archambeault, Doug White, Min Li, James L. Drewniak
Emi Resulting From A Signal Via Transition Through Dc Power Bus-Effectiveness Of Focal Smt Decoupling, Wei Cui, Xiaoning Ye, Bruce Archambeault, Doug White, Min Li, James L. Drewniak
Electrical and Computer Engineering Faculty Research & Creative Works
Signal vias are commonly used in multilayer printed circuit board (PCB) design. For a signal via transitioning through the internal power and ground planes, the return current has to jump from one reference plane to another reference plane. The discontinuity of the return current at the via excites the power and ground planes, and results in power bus noise, and can produce an EMI problem as well. Numerical methods, such as finite-difference time-domain (FDTD), moment methods (MoM), and partial element equivalent circuit (PEEC), were employed herein to study this problem. The modeled results were supported by the measurements. In addition, …
Modeling Emi Resulting From A Signal Via Transition Through Power/Ground Layers, Wei Cui, Xiaoning Ye, Bruce Archambeault, Doug White, Min Li, James L. Drewniak
Modeling Emi Resulting From A Signal Via Transition Through Power/Ground Layers, Wei Cui, Xiaoning Ye, Bruce Archambeault, Doug White, Min Li, James L. Drewniak
Electrical and Computer Engineering Faculty Research & Creative Works
Signal transitioning through layers on vias are very common in multi-layer printed circuit board (PCB) design. For a signal via transitioning through the internal power and ground planes, the return current must switch from one reference plane to another reference plane. The discontinuity of the return current at the via excites the power and ground planes, and results in noise on the power bus that can lead to signal integrity, as well as EMI problems. Numerical methods, such as the finite-difference time-domain (FDTD), Moment of Methods (MoM), and partial element equivalent circuit (PEEC) method, were employed herein to study this …