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Study On Debinding And Sintering Conditions In Extrusion-Based Additive Manufacturing Of 316l And 316l + Cu, Jean-François Silvain, Daniel Lincoln Gifford, Sébastien Fourcade, Laurent Cuzacq, Jean-Luc Grosseau-Poussard, Catherine Debiemme-Chouvy, Nicolas Tessier Doyen, Yongfeng Lu
Study On Debinding And Sintering Conditions In Extrusion-Based Additive Manufacturing Of 316l And 316l + Cu, Jean-François Silvain, Daniel Lincoln Gifford, Sébastien Fourcade, Laurent Cuzacq, Jean-Luc Grosseau-Poussard, Catherine Debiemme-Chouvy, Nicolas Tessier Doyen, Yongfeng Lu
Department of Electrical and Computer Engineering: Faculty Publications
This study investigates the use of a methylcellulose binder in extrusion additive manufacturing of 316L as an alternative to common wax-based binders. Various quantities of copper (Cu) powder were also added in the paste composition to attempt to reduce the sintering temperature by promoting persistent liquid phase sintering. Debinding experiments were conducted under different temperatures and dwell times using argon (Ar), Ar/5%H2, and Ar/1%O2 atmospheres. Debinding reduced carbon (C) content to 0.032 wt.% by using a two-step debinding process of Ar/5%H2 and Ar/1%O2 thermal treatments. Using this debinding process, sintering was conducted at 1200 o …
Influence Of Aluminum Addition On The Laser Powder Bed Fusion Of Copper-Aluminum Mixtures, Nada Kraiem, Loic Constantin, A. Mao, Fei Wang, Bai Cui, Jean-François Silvain, Yongfeng Lu
Influence Of Aluminum Addition On The Laser Powder Bed Fusion Of Copper-Aluminum Mixtures, Nada Kraiem, Loic Constantin, A. Mao, Fei Wang, Bai Cui, Jean-François Silvain, Yongfeng Lu
Department of Electrical and Computer Engineering: Faculty Publications
The high optical reflectivity of copper (Cu) in the near infrared (NIR) domain and its elevated heat dissipation make Cu a challenging metal for laser powder bed fusion (LPBF), even with high energy densities (EDs). In this study, we demonstrated that adding aluminum (Al) powder by as little as 0.75, 1.5, and 3 wt.% substantially enhances Cu processability, leading to denser (up to 98%) and smoother (Ra = 3.3 𝜇m) Cu-Al parts as compared to 95% and 18 𝜇m, respectively, for the parts printed using pure Cu. In addition, this method reduces the ED required by a factor of two …