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Low Damage Processing And Process Characterization, Xianmin Tang
Low Damage Processing And Process Characterization, Xianmin Tang
Dissertations, Theses, and Masters Projects
Two novel plasma sources (one neutral source and one pulsed inductively coupled plasma source) and ashing process characterization were investigated. The primary goal was to characterize these source properties and develop corresponding applications. The study includes process damage assessment with these two sources and another continuous wave (13.56MHz) plasma source. A global average simulation of the pulsed discharges was also included.;The transient plasma density and electron temperature from the double probe analysis were compared with single Langmuir probe results with sheath displacement corrections in pulsed discharges (200Hz--10kHz). The equivalent resistance method can be used effectively to analyze these double probe …
Surface Processing By Rfi Pecvd And Rfi Psii, Lingling Wu
Surface Processing By Rfi Pecvd And Rfi Psii, Lingling Wu
Dissertations, Theses, and Masters Projects
An RFI plasma enhanced chemical vapor deposition (PECVD) system and a large-scale RF plasma source immersion ion implantation (PSII) system were designed and built to study two forms of 3-D surface processing, PECVD and PSII. Using the RFI PECVD system, Ti-6Al-4V substrates were coated with diamond-like carbon films with excellent tribological and optical properties. as an innovation, variable angle spectroscopic ellipsometry (VASE) was successfully applied for non-destructive, 3-D, large-area tribological coatings quality investigation.;Based on the experience with the RFI PECVD system, a large-scale RFICP source was designed and built for the PSIL Langmuir probe and optical emission spectroscopy studies indicated …