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Bilayer Lift-Off Process For Aluminum Metallization, Thomas E. Wilson, Konstantin Korolev, Nathaniel A. Crow
Bilayer Lift-Off Process For Aluminum Metallization, Thomas E. Wilson, Konstantin Korolev, Nathaniel A. Crow
Thomas E. Wilson
Recently published reports in the literature for bilayer lift-off processes have described recipes for the patterning of metals that have recommended metal-ion-free developers, which do etch aluminum. We report the first measurement of the dissolution rate of a commercial lift-off resist (LOR) in a sodium-based buffered commercial developer that does not etch aluminum. We describe a reliable lift-off recipe that is safe for multiple process steps in patterning thin (<100 nm) and thick aluminum devices with micron-feature sizes. Our patterning recipe consists of an acid cleaning of the substrate, the bilayer (positive photoresist/LOR) deposition and development, the sputtering of …