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Santa Clara University

Physics

Series

2015

Articles 1 - 2 of 2

Full-Text Articles in Physics

Transient Reflectance Of Photoexcited Cd3As2, Christopher P. Weber, Ernest Arushanov, Bryan S. Berggren, Tahereh Hosseini, Nikolai Kouklin, Alex Nateprov Jun 2015

Transient Reflectance Of Photoexcited Cd3As2, Christopher P. Weber, Ernest Arushanov, Bryan S. Berggren, Tahereh Hosseini, Nikolai Kouklin, Alex Nateprov

Physics

We report ultrafast transient-grating measurements of crystals of the three-dimensional Dirac semimetal cadmium arsenide, Cd3As2, at both room temperature and 80 K. After photoexcitation with 1.5-eV photons, charge-carriers relax by two processes, one of duration 500 fs and the other of duration 3.1 ps. By measuring the complex phase of the change in reflectance, we determine that the faster signal corresponds to a decrease in absorption, and the slower signal to a decrease in the light's phase velocity, at the probe energy. We attribute these signals to electrons' filling of phase space, first near the photon …


Confocal Sputtering Of Conformal Α-Β Phase W Films On Etched Al Features, John Mark Kreikebaum, Blas Cabrera, Jeffrey J. Yen, Paul L. Brink, Matt Cherry, Astrid Tomada, Betty A. Young Jan 2015

Confocal Sputtering Of Conformal Α-Β Phase W Films On Etched Al Features, John Mark Kreikebaum, Blas Cabrera, Jeffrey J. Yen, Paul L. Brink, Matt Cherry, Astrid Tomada, Betty A. Young

Physics

The authors report on thin-film processing improvements in the fabrication of superconducting quasiparticle-trap-assisted electrothermal-feedback transition-edge sensors used in the design of cryogenic dark matter search detectors. The work was performed as part of a detector upgrade project that included optimization of a new confocal sputtering system and development of etch recipes compatible with patterning 40 nm-thick, α-β mixed-phase W films deposited on 300–600 nm-thick, patterned Al. The authors found that their standard exothermic Al wet etch recipes provided inadequate W/Al interfaces and led to poor device performance. The authors developed a modified Al wet-etch recipe that effectively mitigates geometrical step-coverage …