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Full-Text Articles in Physics
Effects Of Interface Scattering And Carrier Localization On Conductance Of Cu-Based Superlattices, Jiyoon Jessica Kim
Effects Of Interface Scattering And Carrier Localization On Conductance Of Cu-Based Superlattices, Jiyoon Jessica Kim
Legacy Theses & Dissertations (2009 - 2024)
Ultra-thin films and multilayer structures are widely used in modern technologies such as semiconductor logic and memory devices. As film thickness decreases to a few nanometers or smaller, classical transport theories are no longer valid. In this study, we investigate transport properties of superlattices with layer thickness reduced to ~1 nm. The superlattices are made of alternating layers of Cu and a transition metal (Ru, Mo, and Co). The layers are deposited by physical vapor deposition and resistance changes during superlattice growth are measured. The observed resistance evolution reveals the effects of carrier scattering and localization at the interfaces.
Carrier Scattering And Localization In Nm-Thick Al/Ru, Al/Co And Al/Mo Superlattices, Yanli Zhang
Carrier Scattering And Localization In Nm-Thick Al/Ru, Al/Co And Al/Mo Superlattices, Yanli Zhang
Legacy Theses & Dissertations (2009 - 2024)
Thin films and superlattices are widely used in modern technologies. Certain metal superlattices with layer thickness between 1 to 10 nm have interesting magneto transport properties and unique applications in spintronics and data storage. We have studied electrical conductance of Al/Ru, Al/Co, and Al/Mo superlattices with layer thickness between 1 to 2 nm. By monitoring the resistance change during the growth of the superlattice, we are able to observe directly the effects of carrier localization and scattering when a highly disordered interface is being deposited.
Strain Relaxation In Nm-Thick Cu And Cu-Alloy Films Bonded To A Rigid Substrate, Ashley Herrmann
Strain Relaxation In Nm-Thick Cu And Cu-Alloy Films Bonded To A Rigid Substrate, Ashley Herrmann
Legacy Theses & Dissertations (2009 - 2024)
In the wide scope of modern technology, nm-thick metallic films are increasingly used as lubrication layers, optical coatings, plating seeds, diffusion barriers, adhesion layers, metal contacts, reaction catalyzers, etc. A prominent example is the use of nm-thick Cu films as electroplating seed layers in the manufacturing of integrated circuits (ICs). These high density circuits are linked by on-chip copper interconnects, which are manufactured by filling Cu into narrow trenches by electroplating. The Cu fill by electroplating requires a thin Cu seed deposited onto high-aspect-ratio trenches. In modern ICs, these trenches are approaching 10 nm or less in width, and the …
Ruco To Extend The Scalability Of Ultra-Thin Direct Plate Liners, Daniel Verne Greenslit
Ruco To Extend The Scalability Of Ultra-Thin Direct Plate Liners, Daniel Verne Greenslit
Legacy Theses & Dissertations (2009 - 2024)
In traditional semiconductor technology a sputtered copper seed layer is used to improve the adhesion, microstucture, and electromigration characteristics of electrochemically deposited (ECD) copper. The seed layer is deposited on top of a Ta/TaN stack. The Ta layer acts as an adhesion and nucleation layer for the copper seed and the TaN serves as a diffusion barrier for the Cu. As the line widths continue to shrink, scaling each of these layers becomes more difficult. It would be advantageous for the interconnect to be composed of as much copper as possible, transitioning from the traditional liner seed stack to a …
Nucleation, Wetting And Agglomeration Of Copper And Copper-Alloy Thin Films On Metal Liner Surfaces, Stephanie Florence Labarbera
Nucleation, Wetting And Agglomeration Of Copper And Copper-Alloy Thin Films On Metal Liner Surfaces, Stephanie Florence Labarbera
Legacy Theses & Dissertations (2009 - 2024)
One of the key challenges in fabricating narrower and higher aspect ratio interconnects using damascene technology has been achieving an ultra-thin (~2 nm) and continuous Cu seed coverage on trench sidewalls. The thin seed is prone to agglomeration because of poor Cu wetting on the Ta liner. Using in-situ conductance measurements, the effect of lowering the substrate temperature during Cu seed deposition has been studied on tantalum (Ta) and ruthenium (Ru) liner surfaces. On a Ta surface, it was found that lowering the deposition temperature to -65°C increases the nucleation rate of the Cu thin film, and reduces the minimum …
Nanocomposite Thin Films Of Au Nanoparticles Embedded In Yttria-Stabilized Zirconia For Plasmonic-Based Harsh Environment Gas Detection, Phillip Henry Rogers
Nanocomposite Thin Films Of Au Nanoparticles Embedded In Yttria-Stabilized Zirconia For Plasmonic-Based Harsh Environment Gas Detection, Phillip Henry Rogers
Legacy Theses & Dissertations (2009 - 2024)
Increased health concerns due to the emission of gases linked to the production of tropospheric ozone by petroleum based fuel burning engines has resulted in the codification of more stringent emissions regulations domestically. Emissions regulations on commercial jetliners are one of the areas to be met with stricter standards. Currently there is not a sensing technology that can detect the emissions gases in the exhaust stream of a jet turbine engine with lower detection limits that meet these standards.