Physics Commons^™

Thermo-Fluidic Transport Process In A Novel M-Shaped Cavity Packed With Non-Darcian Porous Medium And Hybrid Nanofluid: Application Of Artificial Neural Network (Ann), Dipak Kumar Mandal, Nirmalendu Biswas, Nirmal K. Manna, Dilip Kumar Gayen, Rama S. R. Gorla, Ali J. Chamkha

Faculty Publications

In this work, an attempt has been made to explore numerically the thermo-fluidic transport process in a novel M-shaped enclosure filled with permeable material along with Al₂O₃-Cu hybrid nanoparticles suspended in water under the influence of a horizontal magnetizing field. To exercise the influence of geometric parameters, a classical trapezoidal cavity is modified with an inverted triangle at the top to construct an M-shaped cavity. The cavity is heated isothermally from the bottom and cooled from the top, whereas the inclined sidewalls are insulated. The role of geometric parameters on the thermal performance is scrutinized thoroughly …

Editorial For The Special Issue On Micromachines For Non-Newtonian Microfluidics, Lanju Mei, Shizhi Qian

Mechanical & Aerospace Engineering Faculty Publications

In lieu of an abstract, this is an excerpt from the first page.

Microfluidics has seen a remarkable growth over the past few decades, with its extensive applications in engineering, medicine, biology, chemistry, etc [...]

Computational Studies Of Thermal Properties And Desalination Performance Of Low-Dimensional Materials, Yang Hong

Department of Chemistry: Dissertations, Theses, and Student Research

During the last 30 years, microelectronic devices have been continuously designed and developed with smaller size and yet more functionalities. Today, hundreds of millions of transistors and complementary metal-oxide-semiconductor cells can be designed and integrated on a single microchip through 3D packaging and chip stacking technology. A large amount of heat will be generated in a limited space during the operation of microchips. Moreover, there is a high possibility of hot spots due to non-uniform integrated circuit design patterns as some core parts of a microchip work harder than other memory parts. This issue becomes acute as stacked microchips get …