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An Electrochemical Study Of Electroless Copper Plating Using Glyoxylic Acid As Reducing Agent, Li-Qiong Wu, Fang-Zu Yang
An Electrochemical Study Of Electroless Copper Plating Using Glyoxylic Acid As Reducing Agent, Li-Qiong Wu, Fang-Zu Yang
Journal of Electrochemistry
The electroless copper plating using glyoxylic acid as a reducing agent,Na_(2)EDTA as a chelating agent and K_(4)Fe(CN)_(6) and 2,2'-dipyridyl as additives was studied.The effect of chelating agent and addtives on the polangation behaviovs of copper reduction and glyoxylie acid oxidation were analyzed by linear sweep voltammetry.The results mainly demonstrated that the chelating agent hindered both the oxidation of glyoxylic acid and the reduction of copper complexing ions.It has revealed that K_(4)Fe(CN)_(6)and 2,2'-dipyridyl(with the content over than 20 mg/L)both played negative actions on the oxidation of glyoxylic acid.
A Continuous Operation For Electroreduction Of Oxalic Acid To Glyoxylic Acid, Xiao-Hui Hu, Xiang-Fei Yan, Yu-Zhong Su, Jun Li
A Continuous Operation For Electroreduction Of Oxalic Acid To Glyoxylic Acid, Xiao-Hui Hu, Xiang-Fei Yan, Yu-Zhong Su, Jun Li
Journal of Electrochemistry
A simulative-continuous-operation approach was proposed to study the continuous operation for electroreduction of oxalic acid to gloxylic acid using a packed bed reactor and a parallel reactor with cooled cathode in order to solve the low productivity problem in current state by using traditional reactor.The effects of the concentration of oxalic acid and temperature on this process were also studied.Results showed that,after 30min of the reaction(residence time),the mass fraction of the produced glyoxylic acid in the catholic solution could reach 3.76% and 3.66% with respect to a saturated oxalic acid method and a step-temperature decreasing method.From this study,we conclude that …