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Full-Text Articles in Chemistry
Preparations And Photoelectrochemical Performances Of Rgo-Tio2 Nanotubes Arrays, Ze-Yang Zhang, Lan Sun, Chang-Jian Lin
Preparations And Photoelectrochemical Performances Of Rgo-Tio2 Nanotubes Arrays, Ze-Yang Zhang, Lan Sun, Chang-Jian Lin
Journal of Electrochemistry
Decorating TiO2 nanotube arrays with RGO to improve the photocatalytic activity of TiO2 nanotube arrays has been reported. For the reported RGO-TiO2 nanotube arrays, TiO2 nanotube arrays were prepared by anodizing the high-purity Ti foil in an organic electrolyte for multiple-step treatments, while RGO were deposited on TiO2 nanotube arrays by using cyclic voltammetry or other electrical reduction methods. To enhance the reduction degree and the coverage of RGO on the resultant RGO-TiO2 nanotube arrays, in this work, the one-step electrochemical anodization in hydrofluoric acid was used to fabricate TiO2 nanotube arrays with …
Research Progresses Of Copper Interconnection In Chips, Lei Jin, Jia-Qiang Yang, Fang-Zu Yang, Dong-Ping Zhan, Zhong-Qun Tian, Shao-Min Zhou
Research Progresses Of Copper Interconnection In Chips, Lei Jin, Jia-Qiang Yang, Fang-Zu Yang, Dong-Ping Zhan, Zhong-Qun Tian, Shao-Min Zhou
Journal of Electrochemistry
In this paper, the copper interconnection technology in chip manufacturing is introduced in detail, and the essentials of acidic copper sulfate electroplating process and the mechanisms of common-used additives are reviewed. The progresses of novel additives at home and abroad are also summarized. Based on the studied achievement, the possibility of the novel copper interconnect process replacing the acidic copper electroplating is prospected.