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An Electrochemical Study Of The Effects Of Chelating Agents And Additives On Electroless Copper Plating, Xin Gu, Zhou-Cheng Wang, Chang-Jian Lin
An Electrochemical Study Of The Effects Of Chelating Agents And Additives On Electroless Copper Plating, Xin Gu, Zhou-Cheng Wang, Chang-Jian Lin
Journal of Electrochemistry
In this study, ethylenediaminetetraacetic acid disodium salt (Na_2EDTA), triethanolamine(TEA), and 2,2′-dipyridine were adopted as chelating agents or additives in the electrolyte for electroless copper plating, and formaldehyde (HCHO) was as the reducting agent. Linear sweep voltammetry was applied to analyze the polarization behavior. The peak current of formaldehyde oxidation which increased by the addition of 2,2′-dipyridine is beneficial to formaldehyde oxidation in a specific range of concentration, While TEA decreased the peak current of formaldehyde oxidation. Two cathodic peaks due to copper(Ⅱ)reduction of TEA chelatation and copper(Ⅱ)reduction of EDTA chelatation were examined. EDTA increased the reduction peak current of Cu-EDTA …