Chemistry Commons^™

Introduction Of Development And Application Technology Of Organic Additives For Acid Copper Electroplating, Hao-Bin Zou, Chao-Li Tan, Wei Xiong, Dao-Lin Xi, Bin-Yun Liu

Journal of Electrochemistry

Acid copper electroplating is one of the key technologies in buildup multilayer PCB (BUM-PCB) manufacture process and the most important technique to achieve electrical interconnection between any layer and high-density interconnection in a substrate. This article introduces the research focus of organic additives used in acid copper electroplating, and developing different kinds of micro-via filling copper electroplating technique applied in various scenarios, and some other technical problems from applications. First of all, according to the chronopotentiometric (CP) experiment results, the levelers with different polymeric molecular structures exhibited various responses of cupric deposition potential along with their increased concentrations, which is …