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Electrodeposition Of Copper Into Trenches Under Rotating Hydrodynamic Condition, Jian-Jun Sun

Journal of Electrochemistry

Silicon chips patterned with treneches were fixed onto a rotating electrode. Copper was electrodeposited into the trenches under rotating hydrodynamic conditions The sizes of the trenches are 1 m in height and 0.35 m, 0.50 m and 0.70 m in width, respectively. The effects of rotating of the chip, the current density and the concentration of Cu~(2+ )on the filling of thetrenches were studied. It is found that lower current density and moderate concentration of Cu~(2+)resulted in a void free filling of the trenches.