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Application Of Numerical Simulation Method In Periodic Pulse Reverse Electroplating Through Hole, Yuan-Hang Zhang, Mao-Zhong An, Pei-Xia Yang, Jin-Qiu Zhang

Journal of Electrochemistry

The upgrade of the fifth generation (5G) communication technology increases the number of communication backplane layers and the aspect ratio of through holes on the board, making it more difficult to use traditional direct current deposition for interconnection. Direct current electrodeposition is more prone to uneven coating in the hole, resulting in poor contact between the coating and components, and open circuit. This has a serious impact on the stability of printed circuit board. The periodic pulse reverse plating method can significantly improve the uniformity of high aspect ratio through-hole plating and improve the production quality of through-hole plating through …