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Full-Text Articles in Operations Research, Systems Engineering and Industrial Engineering
Effect Of Gold Content On The Reliability Of Snagcu Solder Joints, Jianbiao Pan, J. Silk, M. Powers, P. Hyland
Effect Of Gold Content On The Reliability Of Snagcu Solder Joints, Jianbiao Pan, J. Silk, M. Powers, P. Hyland
Jianbiao Pan
Electroplated Ni/Au over Cu is a popular metallization for printed circuit board finish as well as for component leads, especially wire-bondable high-frequency packages, where the gold thickness requirement for wire bonding is high. The general understanding is that less than 3 wt% of Au is acceptable in SnPb solder joints. However, little is known about the effect of Au content on the reliability of SnAgCu solder joints. The purpose of this paper is to determine the acceptable level of Au in SAC305 solder joints. Three different package platforms with different Au thicknesses were assembled on boards with two different Au …
Putting Partnership First: A Dialogue Model For Science And Risk Communication, Jen Schneider, Roel Snieder
Putting Partnership First: A Dialogue Model For Science And Risk Communication, Jen Schneider, Roel Snieder
Jen Schneider
In April 2010, the New York Times reported that Vattenfall AB, an energy company owned by the Swedish government, had built one of the first coal-fired power plants designed to capture ~90% of the CO2 it produced, with plans to sequester that CO2 underground in geologic repositories near its plant in Brandenburg, Germany (Voosen, 2010). By most measures, if the plant's operations were proven to be successful, it could have served as a model for other carbon capture and sequestration plants worldwide.