Operations Research, Systems Engineering and Industrial Engineering Commons^™

Consumer Attention To An Over-The-Counter Warning In Four Different Styles Of Design, Abhishek Gawasane, Laura Bix, Javier De La Fuente, Raghav Prashant Sundar, Timothy J. Smith

Industrial Technology and Packaging

The study consisted of three objectives: (a) to test the relative prominence and conspicuousness of a warning required by US law to be conspicuous; (b) to explore whether or not the conspicuousness of the said warning can be enhanced graphically; and (c) to develop preliminary data for power analysis that would guide decisions related to sample size in future studies.

Seventeen subjects viewed four over-the-counter drug packages (each with a different style of warning) along with five other products while wearing an eye tracking device. Four styles of warning were used on the over-the-counter drug packages: no outline and no …

Work In Progress: Outreach Assessment: Measuring Engagement, Lizabeth Schlemer, John Oliver, Katherine Chen, Sophia Rodriguez Mata, Eric Kim

Industrial and Manufacturing Engineering

The Learn By Doing Lab (LBDL) at Cal Poly, San Luis Obispo is an on-campus laboratory where 5th through 8th grade students are taught by undergraduates who may be planning a careers in teaching. The two populations - elementary students and undergraduates - are equally important in the process. Since 2008, the lab has seen over 4000 elementary and junior high students and over 100 undergrads have participated. In most outreach assessment the number of individuals participating is an important metric, but this last Spring we experimented with a more in depth measure of effectiveness. As in any learning experience …

Assessing Lean Systems Using Variability Mapping, Ahmed Deif

Industrial Technology and Packaging

A new approach to assess lean manufacturing based on system's variability is proposed. The assessment utilizes a new tool called variability source mapping (VSMII) which focuses on capturing and reducing variability across the production system. The new tool offers a new metric called variability index to measure the overall variability level of the system. Based on the mapping and the new metric, VSMII suggests a variability reduction plan guided by a recommendation list of both lean techniques as well as production control policies. An industrial application is used to demonstrate the new tool. Results show that VSMII managed to reduce …

Integrating Courses Through Project Based Learning, Lizabeth Schlemer, Sema E. Alptekin, Karen R. Bangs

Industrial and Manufacturing Engineering

Integrating three courses (one sophomore level, two senior level) through Project Based Learning (PBL) within the Industrial Engineering curriculum at the California Polytechnic State University, San Luis Obispo is presented. Three courses (IME 443 Facilities Planning and Design - senior level; IME 420 Simulation - senior level; and IME 223 Process Improvement Fundamentals - sophomore level) were linked by various mechanisms: Common industry projects, common students in two of the three courses; senior students having access to sophomores in their teams to carry out time consuming tasks such as time studies, and sophomores having access to seniors as team members, …

Effect Of Gold Content On The Microstructural Evolution Of Sac305 Solder Joints Under Isothermal Aging, Mike Powers, Jianbiao Pan, Julie Silk, Patrick Hyland

Industrial and Manufacturing Engineering

Au over Ni on Cu is a widely used printed circuit board (PCB) surface finish, under bump metallization (UBM), and component lead metallization. It is generally accepted that less than 3 wt.% Au in Sn-Pb solder joints inhibits formation of detrimental intermetallic compounds (IMC). However, the critical limit for Au content in Pb-free solder joints is not well established. Three surface-mount package platforms, one with a matte Sn surface finish and the others with Ni/Au finish, were soldered to Ni/Au-finished PCB using Sn-3.0Ag- 0.5Cu (SAC305) solder, in a realistic manufacturing setting. The assembled boards were divided into three groups: one …

The Morphology Evolution And Voiding Of Solder Joints On Qfn Central Pads With A Ni/Au Finish, Julie Silk, Jianbiao Pan, Mike Powers

Industrial and Manufacturing Engineering

In this paper, we report on a comprehensive study regarding the morphology evolution and voiding of SnAgCu solder joints on the central pad of two different packages – QFN and an Agilent package called TOPS – on PCBs with a Ni/Au surface finish. Samples were isothermally aged at the equivalent of 0, 2, 7 and 14 years service life. Representative solder joints were cross-sectioned and analyzed using scanning electron microscopy (SEM) and energy dispersive X-ray spectroscopy (EDX) in order to investigate the evolution of the solder joint morphology as a function of Au content and isothermal aging. IMC thickness was …

Dynamic Analysis Of A Lean Cell Under Uncertainty, Ahmed M. Deif

Industrial Technology and Packaging

One of the ultimate targets of lean manufacturing paradigm is to balance production and produce at takt time in production cells. This paper investigates the performance of a lean cell that implements the previous lean goals under uncertainty. The investigation is based on a system dynamics approach to model a dynamic lean cell. Backlog is used as a performance metric that reflects the cell’s responsiveness. The cell performance is compared under certain and uncertain external (demand) and internal (machine availability) conditions. Results showed that although lean cell is expected to be responsive to external demand with minimum waste, however, this …

Measurement And Analysis Of Vehicle Vibration For Delivering Packages In Small‐Sized And Medium‐Sized Trucks And Automobiles, Vanee Chonhenchob, Sher Paul Singh, Jay Jagjit Singh, Joseph Stallings, Gary Grewal

Industrial Technology and Packaging

In distribution, packaged products are subjected to the variation in vibration levels from transport vehicles that vary in frequency and acceleration while moving to their destinations. This vibration may negatively affect the product or packaging. This study measured and analysed vibration levels in vehicles commonly used to transport packages in the last leg of the package delivery service that is used by single‐parcel carriers. Using data recorders, we monitored vertical, lateral and longitudinal vibrations over 75 h of travel time in five different types of small and medium package delivery vehicles. The study presents these data as power density (PD) …