Operations Research, Systems Engineering and Industrial Engineering Commons^™

Effect Of Chromium–Gold And Titanium–Titanium Nitride–Platinum–Gold Metallization On Wire/Ribbon Bondability, Jianbiao Pan, Robert M. Pafchek, Frank F. Judd, Jason B. Baxter

Industrial and Manufacturing Engineering

Gold metallization on wafer substrates for wire/ribbon bond applications requires good bond strength to the substrate without weakening the wire/ribbon. This paper compares the ribbon bondability of Cr-Au and Ti-TiN-Pt-Au metallization systems for an optoelectronic application. Both Chromium and Titanium are used to promote adhesion between semiconductor substrates and sputtered gold films. However, both will be oxidized if they diffuse to the gold surface and result in the degradation of the wire/ribbon bondability. Restoring bondability by ceric ammonium nitrate (CAN) etch was investigated. Experiments were conducted to investigate the effect of Cr-Au and Ti-TiN-Pt-Au, annealing, and CAN etch processes, on …

Investigation Of The Lead-Free Solder Joint Shear Performance, James Webster, Jianbiao Pan, Brian J. Toleno

Industrial and Manufacturing Engineering

Reflow profile has significant impact on solder joint performance because it influences wetting and microstructure of the solder joint. The purpose of this study is to investigate the effects of reflow profile and thermal shock on the shear performance of eutectic SnPb (SnPb) and Sn3.0Ag0.5Cu (SAC305) solder joints. Test boards were assembled with four different sized surface mount chip resistors (1206, 0805, 0603 and 0402). Nine reflow profiles for SAC 305 and nine reflow profiles for SnPb were developed with three levels of peak temperature (12ºC, 22ºC, and 32ºC above solder liquidus temperature, or 230ºC, 240ºC, and 250ºC for SAC …

Estimation Of Liquidus Temperature When Snagcu Bga/Csp Components Are Soldered With Snpb Paste, Jianbiao Pan

Industrial and Manufacturing Engineering

Recently, the soldering of lead-free components with SnPb paste, or lead-free backward compatibility, is becoming a hot topic. One of the major challenges in backward compatibility assembly is the development of a right reflow profile for the soldering of SnAgCu Ball Grid Array (BGA)/Chip Scale Package (CSP) components with SnPb paste. If the SnAgCu reflow profile is used, the reflow temperature may be too high for other SnPb components in the same board during assembly according to the component rating per IPC/JEDEC J-STD-020C. In addition, the flux in SnPb solder paste may not function properly in such a high reflow …

Order And Disorder, Entropy In Math, Science, Nature And The Arts, Sol Neeman Ph.D., Arie Maharshak

Engineering Studies Faculty Publications and Creative Works

Often, science and engineering students have difficult time in viewing certain concepts in their holistic form. An example for such a concept is the concept of Entropy. Although it originated from the field of thermodynamics, the relation between order and disorder is a profound one and manifests itself in various fields, sometimes unrelated, such as math and science, nature and the arts. In the discipline of physics, the amount of disorder in a system has been quantified by the concept of Entropy. In the area of information theory it provides a quantitative measure of the amount of compression that may …

A Comparative Study Of Various Loss Functions In The Economic Tolerance Design, Jehnan Pan, Jianbiao Pan

Industrial and Manufacturing Engineering

Engineering tolerance design plays an important role in modern manufacturing. In this paper, the Kapur's model was modified so that the economic specification limits for both symmetric and asymmetric losses can be established. Three different loss functions: (1) Taguchi's quadratic loss function; (2) Inverted Normal Loss Function; (3) Revised Inverted Normal Loss Function are compared in the economic tolerance design. The relationships between the three loss functions and process capability indices for symmetric tolerance are established. The results suggest that the revised inverted normal loss function be used in determination of economic specification limits.

Plotting A Bright Future For Manufacturing Education: Results Of A Brainstorming Session, Daniel Waldorf, Sema E. Alptekin, Robert Bjurman

Industrial and Manufacturing Engineering

Manufacturing industries worldwide have undergone dramatic changes in recent years and now demand more from graduating manufacturing engineers. The effects of globalization have forever changed the parameters for success in manufacturing. Our educational institutions must respond to these changes with innovation. That agenda formed the basis for a special SME/CIRP international conference on manufacturing engineering education called “Looking Forward: Innovations in Manufacturing Engineering Education,” held in San Luis Obispo, California, June 22-25, 2005. At the meeting, manufacturing education professionals from around the world came together to share their own innovative ideas and to brainstorm ways to shape the future of …

Measuring Plant-Wide Energy Savings, J. Kelly Kissock, Carl Eger

Mechanical and Aerospace Engineering Faculty Publications

This paper presents a general method for measuring plant-wide industrial energy savings and demonstrates the method using a case study from an actual industrial energy assessment. The method uses regression models to characterize baseline energy use. It takes into account changes in weather and production, and can use sub-metered data or whole plant utility billing data. In addition to calculating overall savings, the method is also able to disaggregate savings into components, which provides additional insight into the effectiveness of the individual savings measures.

Although the method incorporates search techniques and multi-variable least-squares regression, it is easily implemented using data …

Processing Model For Tungsten Powders And Extention To Nanoscale Size Range, Randall M. German, J. Ma, X. Wang, E. Olevsky

Industrial and Manufacturing Engineering

Nanoscale tungsten powders promise access to very hard, strong and wear resistant materials via the press–sinter route. A small particle size changes the response during sintering, requiring lower temperatures and shorter times to attain dense but small grain size structures. On the other hand, oxide reduction and impurity evaporation favour high sintering temperatures and long hold times. Accordingly, press–sinter processing encounters conflicting constraints when applied to small particles. Presented here is an analysis of press–sinter tungsten particle processing to isolate conditions that balance the temperature and size dependent effects. The calculations are pinned by existing data. Opportunities are identified for …

The Effect Of Reflow Profile On Snpb And Snagcu Solder Joint Shear Strength, Jianbiao Pan, Brian J. Toleno, Tzu-Chien Chou, Wesley J. Dee

Industrial and Manufacturing Engineering

Purpose –The purpose of this work is to study the effect of the reflow peak temperature and time above liquidus on both SnPb and SnAgCu solder joint shear strength.

Design/methodology/approach –Nine reflow profiles for Sn3.0Ag0.5Cu and nine reflow profiles for Sn37Pb have been developed with three levels of peak temperature (230°C, 240°C, and 250°C for Sn3.0Ag0.5Cu; and 195°C, 205°C, and 215°C for Sn37Pb) and three levels of time above solder liquidus temperature (30, 60, and 90 s). The shear force data of four different sizes of chip resistors (1206, 0805, 0603, and 0402) are compared across the different …

A Simplified Model For Ploughing Forces In Turning, Daniel Waldorf

Industrial and Manufacturing Engineering

This paper aims to provide experimental data in support of a modified theoretical model for quantifying the effect of cutting tool edge geometry on machining forces. A previously published slip-line model is simplified and extended to the case of turning. Several sets of machining experiments were run with custom-fabricated cutting inserts of varying edge hone radius and chamfer geometry. Cutting forces were measured using a dynamometer during cutting. Results show that varying edge geometry can have a major effect on cutting forces. The developed model effectively captures the edge phenomenon and its effect on cutting forces and also offers a …

Neural Network-Based Output Feedback Controller For Lean Operation Of Spark Ignition Engines, Brian C. Kaul, Jagannathan Sarangapani, J. A. Drallmeier, Jonathan B. Vance, Pingan He

Electrical and Computer Engineering Faculty Research & Creative Works

Spark ignition (SI) engines running at very lean conditions demonstrate significant nonlinear behavior by exhibiting cycle-to-cycle dispersion of heat release even though such operation can significantly reduce NOx emissions and improve fuel efficiency by as much as 5-10%. A suite of neural network (NN) controller without and with reinforcement learning employing output feedback has shown ability to reduce the nonlinear cyclic dispersion observed under lean operating conditions. The neural network controllers consists of three NN: a) A NN observer to estimate the states of the engine such as total fuel and air; b) a second NN for generating virtual input; …