Open Access. Powered by Scholars. Published by Universities.®
Operations Research, Systems Engineering and Industrial Engineering Commons™
Open Access. Powered by Scholars. Published by Universities.®
Articles 1 - 1 of 1
Full-Text Articles in Operations Research, Systems Engineering and Industrial Engineering
The Effect Of Reflow Profile On Snpb And Snagcu Solder Joint Shear Strength, Jianbiao Pan, Brian J. Toleno, Tzu-Chien Chou, Wesley J. Dee
The Effect Of Reflow Profile On Snpb And Snagcu Solder Joint Shear Strength, Jianbiao Pan, Brian J. Toleno, Tzu-Chien Chou, Wesley J. Dee
Industrial and Manufacturing Engineering
Purpose –The purpose of this work is to study the effect of the reflow peak temperature and time above liquidus on both SnPb and SnAgCu solder joint shear strength.
Design/methodology/approach –Nine reflow profiles for Sn3.0Ag0.5Cu and nine reflow profiles for Sn37Pb have been developed with three levels of peak temperature (230°C, 240°C, and 250°C for Sn3.0Ag0.5Cu; and 195°C, 205°C, and 215°C for Sn37Pb) and three levels of time above solder liquidus temperature (30, 60, and 90 s). The shear force data of four different sizes of chip resistors (1206, 0805, 0603, and 0402) are compared across the different …