Operations Research, Systems Engineering and Industrial Engineering Commons^™

Lead-Free Solder Joint Reliability – State Of The Art And Perspectives, Jianbiao Pan, Jyhwen Wang, David M. Shaddock

Industrial and Manufacturing Engineering

There is an increasing demand in replacing tin-lead (Sn/Pb) solders with lead-free solders in the electronics industry due to health and environmental concern. The European Union recently passed a law to ban the use of lead in electronic products. The ban will go into effect in July of 2006. The Japanese electronics industry has worked to eliminate lead from consumer electronic products for several years. Although currently there are no specific regulations banning lead in electronics devices in the United States, many companies and consortiums are working on lead-free solder initiatives including Intel, Motorola, Agilent Technologies, General Electric, Boeing, NEMI …

Work Flow Policy And Within-Worker And Between-Workers Variability In Performance, Kenneth Howard Doerr, Tali Freed, Terence R. Mitchell, Chester A. Schriesheim, Xiaohua Zhou

Industrial and Manufacturing Engineering

Work flow policies are shown to induce a change in average between-workers variability (worker heterogeneity) and within-worker variability in performance times. In a laboratory experiment, the authors measured the levels of worker heterogeneity and within-worker variability under an individual performance condition, a work sharing condition, and a fixed assignment condition. The work sharing policy increased the levels of worker heterogeneity and worker variability, whereas the fixed assignment policy decreased them. These effects, along with work flow policy main effects on mean performance times and variability are examined. This article represents an initial step in understanding effects that may be important …

Lean Energy Analysis: Identifying, Discovering And Tracking Energy Savings Potential, J. Kelly Kissock, John Seryak

Mechanical and Aerospace Engineering Faculty Publications

Energy in manufacturing facilities is used for direct production of goods, space conditioning, and general facility support such as lighting. This paper presents a methodology, called lean energy analysis, LEA, for graphically and statistically analyzing plant energy use in terms of these major end uses.

The LEA methodology uses as few as 60 easily obtainable data points. Multivariable change-point models of electricity and natural gas use as functions of outdoor air temperature and production data are developed. The statistical models are used to subdivide plant energy use into facility, space-conditioning and production-related components.

These breakdowns suggest the savings potential from …

Wire Bonding Challenges In Optoelectronics Packaging, Jianbiao Pan, Patrice Fraud

Industrial and Manufacturing Engineering

Wire bonding has been used in integrated circuit (IC) packaging for many years. However, there are many challenges in wire bonding for optoelectronics packaging. These challenges include bonding on sensitive devices, bonding over cavity, bonding over cantilevel leads and bonding temperature limitations. The optoelectronics package design brings another challenge, which requires wire bonding to have deep access capability. In this paper, the wire bonding technologies are reviewed and ball bonding and wedge bonding are compared. The variables that affect the wire bonding process are then discussed. Finally, the challenges of wire bonding in optoelectronics packaging are presented in detail.

Effect Of Chromium-Gold And Titanium-Titanium Nitride-Platinum-Gold Metallization On Wire/Ribbon Bondability, Jianbiao Pan, Robert M. Pafchek, Frank F. Judd, Jason Baxter

Industrial and Manufacturing Engineering

Gold metallization on wafer substrates for wire/ribbon bond applications require good bond strength to the substrate without weakening the wire/ribbon. This paper compares the ribbon bondability of Cr/Au and Ti/TiN/Pt/Au metallization systems. Both chromium and titanium are used to promote adhesion between substrates and sputtered gold films. Both can diffuse the gold surface after annealing and degrade the wire/ribbon bondability. Restoring bondability by ceric ammonium nitrate (CAN) etch was investigated. Experiments were conducted to investigate the effect of Cr/Au and Ti/TiN/Pt/Au, annealing, and CAN etch processes on 25.4 times; 254 μm (1 × 10 mil) ribbon bonding. All bonds were …

Project-Based Introduction To Engineering - A University Core Course, Samuel Bogan Daniels, Bouzid Aliane, Jean Nocito-Gobel, Michael Collura

Engineering and Applied Science Education Faculty Publications

This paper describes a first year engineering course that is taken by both engineering and non-engineering students. The project-based Introduction to Engineering course, EAS107P, fulfills a university core curriculum elective. Although engineering students take the course during their first year, students from other majors typically elect to take the course later in their curriculum. The focus of EAS107P is to have students experience the engineering design and problem solving process in a multi-disciplinary, team-based setting. In addition to learning about design, students develop an interest in the engineering profession and build a foundation of skills for future work. An additional …

Development Of A Multidisciplinary Engineering Foundation Spiral, Samuel Bogan Daniels, Bouzid Aliane, Jean Nocito-Gobel, Michael Collura

Engineering and Applied Science Education Faculty Publications

To operate effectively in today’s workforce engineers need to have a muti-disciplinary perspective along with substantial disciplinary depth. This broad perspective cannot be achieved by merely taking 2 or 3 engineering courses outside of the major, but rather will require a radical change in the way we educate engineers. The faculty of the School of Engineering and Applied Science at the University of New Haven have developed a new approach: the Multidisciplinary Engineering Foundation Spiral. This curricular model provides the needed mix of breadth and depth, along with the desired professional skills, by providing carefully crafted, well-coordinated curricular experiences in …

Project-Based Introduction To Engineering -- Course Assessment, Samuel Bogan Daniels, Michael Collura, Bouzid Aliane, Jean Nocito-Gobel

Engineering and Applied Science Education Faculty Publications

The School of Engineering and Applied Science at the University of New Haven has a newly developed project-based Introduction to Engineering course. This new course plays a central role in the new Multi-Disciplinary Engineering Foundation Spiral curriculum as the first semester course for all engineering freshmen. An assessment process was developed to determine the effectiveness of this project-based course, specifically with attention towards assessing attitudes, impact on retention, problem-solving and engineering foundation topics. This paper addresses the particular portion of the assessment process for the individual course projects and their contribution to the last two assessment categories.

Project Planning & Development For Engineering Freshmen, Bouzid Aliane, Michael Collura, Samuel Bogan Daniels, Jean Nocito-Gobel

Engineering and Applied Science Education Faculty Publications

The nature and background of students seeking an engineering education has changed drastically in the last decade, as has the expectations of industrial employers. Many students lack the organizational skills needed for academic success. Similar organizational skills, although more advanced, are required for managing engineering projects. A new course was developed by the faculty at the School of Engineering and Applied Science at the University of New Haven. Through this course, a key component of the Multidisciplinary Engineering Foundation Spiral, seeks to promote higher retention rates, increase student motivation and begin a confidence-building transition to professional practice. Project management concepts …

Critical Variables Of Solder Paste Stencil Printing For Micro-Bga And Fine-Pitch Qfp, Jianbiao Pan, Gregory L. Tonkay, Robert H. Storer, Ronald M. Sallade, David J. Leandri

Industrial and Manufacturing Engineering

Stencil printing continues to be the dominant method of solder deposition in high-volume surface-mount assembly. Control of the amount of solder paste deposited is critical in the case of fine-pitch and ultrafine-pitch surface-mount assembly. The process is still not well understood as indicated by the fact that industry reports 52-71% surface-mount technology (SMT) defects are related to the solder paste stencil printing process. The purpose of this paper is to identify the critical variables that influence the volume, area, and height of solder paste deposited. An experiment was conducted to investigate the effects of relevant process parameters on the amount …

A Supply Chain Management Tool For Linking Courses In Manufacturing Engineering , Daniel Waldorf, Sema E. Alptekin

Industrial and Manufacturing Engineering

A Recent Society of Manufacturing Engineers (SME) grant received by Manufacturing Engineering Program at Cal Poly has provided funds to strengthen its curricular focus on supply chain management, flexibility, business skills, quality, and process controls. New courses and laboratories are developed in electronics manufacturing, information technology, and supply chain management. A functioning supply chain environment has been developed to provide vertical integration among several courses. A software tool being developed in-house integrates the activities of the students who play the roles of customers and suppliers. Details of the various components of this comprehensive project are presented in this paper.

The Frequency Distribution Of Quantization Error In Digitizers For Coherent Sampling, Sol Neeman Ph.D.

Engineering Studies Faculty Publications and Creative Works

In this paper the frequency distribution of quantization error in coherent sampling of digitizers will be investigated. As the distribution of the quantization error affects the values of THD and SNR, it is relevant for a correct interpretation of THD and SNR of sine waves in coherent sampling. The distribution of the quantization error will be analyzed as a function of N, total number of samples and M, number of cycles in the sample set and it will be proved that for certain cases, the quantization error falls on odd harmonics only of the frequency of the sampled sine wave.