Operations Research, Systems Engineering and Industrial Engineering Commons^™

Gauge Repeatability & Reproducibility Study For A 3-D Solder Paste Inspection System, Jianbiao Pan, Gregory L. Tonkay, Robert H. Storer, Ronald M. Sallade, David J. Leandri

Industrial and Manufacturing Engineering

Due to the increased use of Ball Grid Arrays (BGAs) and fine pitch and ultra fine pitch Quad Flat Packages (QFPs), there is a dramatic increase in demand for solder paste inspection after the stencil printing process. The important response variables of the printing process are deposited solder paste volume, area, height and position. To identify and remove defects at the earliest possible process step, a 3-D solder paste inspection system should be used to monitor solder paste deposited on all pads on every board before component placement. An example is a fully automatic laser-based 3-D triangulation solder paste inspection …