Open Access. Powered by Scholars. Published by Universities.®

Operations Research, Systems Engineering and Industrial Engineering Commons

Open Access. Powered by Scholars. Published by Universities.®

Articles 1 - 2 of 2

Full-Text Articles in Operations Research, Systems Engineering and Industrial Engineering

Electronic Monitoring Of Hand Hygiene Compliance In An Inpatient Hospital Setting, Christopher M. Masek Nov 2011

Electronic Monitoring Of Hand Hygiene Compliance In An Inpatient Hospital Setting, Christopher M. Masek

Department of Industrial and Management Systems Engineering: Dissertations, Theses, and Student Research

Proper hand hygiene is known to reduce hospital acquired infections. Currently the most widely accepted method used to measure hand hygiene compliance is through direct observation. This method often provides data that may not accurately represent true hand hygiene compliance due to such factors such as the Hawthorne Effect. Perhaps a better approach is to use counting devices to capture hand hygiene opportunities and activities. This thesis focuses on the measurement of hand hygiene activities of all individuals that either work or visit an inpatient medical ward including healthcare workers, patients and visitors at the patient’s bedside for non-isolation patients. …


Gauge Repeatability & Reproducibility Study For A 3-D Solder Paste Inspection System, Jianbiao Pan, Gregory L. Tonkay, Robert H. Storer, Ronald M. Sallade, David J. Leandri Oct 1999

Gauge Repeatability & Reproducibility Study For A 3-D Solder Paste Inspection System, Jianbiao Pan, Gregory L. Tonkay, Robert H. Storer, Ronald M. Sallade, David J. Leandri

Industrial and Manufacturing Engineering

Due to the increased use of Ball Grid Arrays (BGAs) and fine pitch and ultra fine pitch Quad Flat Packages (QFPs), there is a dramatic increase in demand for solder paste inspection after the stencil printing process. The important response variables of the printing process are deposited solder paste volume, area, height and position. To identify and remove defects at the earliest possible process step, a 3-D solder paste inspection system should be used to monitor solder paste deposited on all pads on every board before component placement. An example is a fully automatic laser-based 3-D triangulation solder paste inspection …