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Operations Research, Systems Engineering and Industrial Engineering Commons

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Full-Text Articles in Operations Research, Systems Engineering and Industrial Engineering

Failure Analysis Of Philos Plate Construct Used For Pantalar Arthrodesis Paper Ii-Screws And Fem Simulations, Farah Hamandi, Richard T. Laughlin, Tarun Goswami Apr 2018

Failure Analysis Of Philos Plate Construct Used For Pantalar Arthrodesis Paper Ii-Screws And Fem Simulations, Farah Hamandi, Richard T. Laughlin, Tarun Goswami

Biomedical, Industrial & Human Factors Engineering Faculty Publications

A fractured stainless steel 3.5 mm proximal humerus internal locking system (PHILOS) plate and screws were investigated in this paper. This plate was used for ankle arthrodesis of a 68-year-old female with a right ankle deformity. Both the plate and screws were considered in this investigation. Optical and scanning electron microscopes (SEM) were used to document fracture surface characteristics, such as extensive scratching, plastic deformation, rubbed surfaces, discoloration, and pitting, along with cleavage, secondary cracking, deposits of debris, striations, and dimples. Indications of these features show that the plate failed by corrosion fatigue, however, overloading separated the screw(s) in two …


Analysis Of A Clinically Failed, Mechanically Intact, Hemi-Toe Implant, Swetha Varadharajan, Richard T. Laughlin, Tarun Goswami Jan 2016

Analysis Of A Clinically Failed, Mechanically Intact, Hemi-Toe Implant, Swetha Varadharajan, Richard T. Laughlin, Tarun Goswami

Biomedical, Industrial & Human Factors Engineering Faculty Publications

In this case study a clinically failed, mechanically intact, hemi-toe device was investigated. The clinical indication of the failure constitutes radiolucent line indicating loosening of the implant and possible interactions among the bone-implant initiated by osteolysis may become a factor, producing pain, inflammatory reactions, deformity and discomfort. The patient file was not available to determine these parameters. The device was titanium coated, Cobalt Chromium alloy used for making hemi-toe. Degeneration of hemi implant was due to spalling of the coating from the surface, causing loosening of stem from bone. However, pre-removal X-ray films were not available to confirm. Mechanism by …


Analysis Of A Clinically Failed, Mechanically Intact, Reconstructive Compression Plate, Bharadwaj Cheruvu, Sunil Karmacharya, Richard T. Laughlin, Tarun Goswami Sep 2015

Analysis Of A Clinically Failed, Mechanically Intact, Reconstructive Compression Plate, Bharadwaj Cheruvu, Sunil Karmacharya, Richard T. Laughlin, Tarun Goswami

Biomedical, Industrial & Human Factors Engineering Faculty Publications

A reconstructive orthopedic bone plate was submitted for analysis. Traditional failure analysis methods were used to assess the mode of the plate failure. Metallographic investigation of the plate was carried out in this report. Since limited data was available in the literature and clinical data related to subject demography, date of removal as well as reasons for removal unknown, in depth analysis was not possible. However, the plate was received in in-tact condition with minor biological deposits and scratches, it is speculated that the failure of the plate may have been due to biological/clinical reasons, likely infection, rejecting the device …


The Effect Of Reflow Profile On Snpb And Snagcu Solder Joint Shear Strength, Jianbiao Pan, Brian J. Toleno, Tzu-Chien Chou, Wesley J. Dee Jan 2006

The Effect Of Reflow Profile On Snpb And Snagcu Solder Joint Shear Strength, Jianbiao Pan, Brian J. Toleno, Tzu-Chien Chou, Wesley J. Dee

Industrial and Manufacturing Engineering

Purpose –The purpose of this work is to study the effect of the reflow peak temperature and time above liquidus on both SnPb and SnAgCu solder joint shear strength.

Design/methodology/approach –Nine reflow profiles for Sn3.0Ag0.5Cu and nine reflow profiles for Sn37Pb have been developed with three levels of peak temperature (230°C, 240°C, and 250°C for Sn3.0Ag0.5Cu; and 195°C, 205°C, and 215°C for Sn37Pb) and three levels of time above solder liquidus temperature (30, 60, and 90 s). The shear force data of four different sizes of chip resistors (1206, 0805, 0603, and 0402) are compared across the different …