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Reliability Analysis Of Low-Silver Bga Solder Joints Using Four Failure Criteria, Erin A. Kimura
Reliability Analysis Of Low-Silver Bga Solder Joints Using Four Failure Criteria, Erin A. Kimura
Master's Theses
The appropriate selection of failure criterion for solder joint studies is necessary to correctly estimate reliability life. The objective of this study is to compare the effect of different failure criteria on the reliability life estimation. The four failure criteria in this study are a 20% resistance increase defined in the IPC-9701A standard, a resistance beyond 500 Ω, an infinite resistance (hard open), and a failure criterion based on X-bar and R control charts. Accelerated thermal cycling conditions of a low-silver BGA study included 0°C to 100 °C with ten minute dwell times and -40°C to 125°C with ten minute …