Operations Research, Systems Engineering and Industrial Engineering Commons^™

Reliability Analysis Of Low-Silver Bga Spheres Comparing Failure Detection Criteria, Briana Fredericks

Industrial and Manufacturing Engineering

One of the challenges of solder joint reliability tests is estimating the time of failure of the solder joint. Failure criteria should be able to detect solder joint failure as early as possible, while minimizing the probability of false detection. The failure mechanism under study is cracks due to thermal fatigue. The most common method to estimate failure due to cracks is to monitor the resistance during testing, because solder imaging and cross-sectioning methods are destructive. Current industry failure criteria do not adequately demonstrate the relationship between the size of the crack and the resulting change in resistance. This project …