Operations Research, Systems Engineering and Industrial Engineering Commons^™

Effect Of Gold Content On The Microstructural Evolution Of Sac305 Solder Joints Under Isothermal Aging, Mike Powers, Jianbiao Pan, Julie Silk, Patrick Hyland

Industrial and Manufacturing Engineering

Au over Ni on Cu is a widely used printed circuit board (PCB) surface finish, under bump metallization (UBM), and component lead metallization. It is generally accepted that less than 3 wt.% Au in Sn-Pb solder joints inhibits formation of detrimental intermetallic compounds (IMC). However, the critical limit for Au content in Pb-free solder joints is not well established. Three surface-mount package platforms, one with a matte Sn surface finish and the others with Ni/Au finish, were soldered to Ni/Au-finished PCB using Sn-3.0Ag- 0.5Cu (SAC305) solder, in a realistic manufacturing setting. The assembled boards were divided into three groups: one …