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Designing And Manufacturing Microelectronic Packages For High-Power Light-Emitting Diodes, Brian Wright, Jianbiao Pan, Richard Savage
Designing And Manufacturing Microelectronic Packages For High-Power Light-Emitting Diodes, Brian Wright, Jianbiao Pan, Richard Savage
Industrial and Manufacturing Engineering
A new microelectronic package was designed for a high-power light-emitting diode (LED). The objective was to build a package that enables the LED to operate with currents as high as 2 Amps. An innovative thin-film interface has been developed to electrically connect the cathode of the LED die to a 22AWG Cu wire. This thin-film interface is wirebondable and solderable, and consists of three layers: Au, Ni93/V7, and Si. Four 1 mil Au wirebonds, supporting 2A of maximum current, connect the Au thin-film to the LED die cathode. Sn96Ag4 solder is used for connecting the Ni93/V7 thin-film to the 22AWG …