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Full-Text Articles in Nanoscience and Nanotechnology

High-Throughput Assembly Of Nanoelements In Nanoporous Alumina Templates, Evin Gultepe, Dattatri K. Nagesha, Latika Menon, Ahmed A. Busnaina, Srinivas Sridhar Apr 2012

High-Throughput Assembly Of Nanoelements In Nanoporous Alumina Templates, Evin Gultepe, Dattatri K. Nagesha, Latika Menon, Ahmed A. Busnaina, Srinivas Sridhar

Srinivas Sridhar

The authors demonstrate a nanofabrication method utilizing nanoporous alumina templates which involves directed three dimensional assembly of nanoparticles inside the pores by means of an electrophoretic technique. In their demonstration, they have assembled polystyrene nanobeads with diameter of 50 nm inside nanopore arrays of height of 250 nm and diameter of 80 nm. Such a technique is particularly useful for large-scale, rapid assembly of nanoelements for potential device applications.


Experimental And Numerical Investigation Of Nanoparticle Removal Using Acoustic Streaming And The Effect Of Time, Kaveh Bakhtari, Rasim O. Guldiken, Prashanth Makaram, Ahmed A. Busnaina, Jin-Goo Park Apr 2012

Experimental And Numerical Investigation Of Nanoparticle Removal Using Acoustic Streaming And The Effect Of Time, Kaveh Bakhtari, Rasim O. Guldiken, Prashanth Makaram, Ahmed A. Busnaina, Jin-Goo Park

Jin-Goo Park

Theremoval of nanoparticles is becoming increasingly challenging as the minimumlinewidth continues to decrease in semiconductor manufacturing. In this paper,the removal of nanoparticles from flat substrates using acoustic streamingis investigated. Bare silicon wafers and masks with a 4 nmsilicon cap layer are cleaned. The silicon-cap films are usedin extreme ultraviolet masks to protect Mo–Si reflective multilayers. Theremoval of 63 nm polystyrene latex (PSL) particles from these substratesis conducted using single-wafer megasonic cleaning. The results show higherthan 99% removal of PSL nanoparticles. The results also showthat dilute SC1 provides faster removal of particles, which isalso verified by the analytical analysis. Particle removal …


Effect Of Different Deposition Mediums On The Adhesion And Removal Of Particles, S. Hu, Tae-Hoon Kim, Jin-Goo Park, Ahmed A. Busnaina Apr 2012

Effect Of Different Deposition Mediums On The Adhesion And Removal Of Particles, S. Hu, Tae-Hoon Kim, Jin-Goo Park, Ahmed A. Busnaina

Jin-Goo Park

The purpose of this study is to investigate the effect of the different deposition mediums on the adhesion and removal of particles. Polystyrene latex (PSL) particles (50 µm) are deposited on thermal oxide and silicon nitride coated silicon wafers using different suspension mediums: air, isopropyl alcohol (IPA), and deionized water and then removed in a dry environment. The results show that PSL particles deposited on oxide are easier to remove than those on nitride due to a higher van der Waals force in all deposition mediums. In addition, dry particles deposited in air are much easier to remove than those …


Experimental And Analytical Study Of Submicrometer Particle Removal From Deep Trenches, Kaveh Bakhtari, Rasim O. Guldiken, Ahmed A. Busnaina, Jin-Goo Park Apr 2012

Experimental And Analytical Study Of Submicrometer Particle Removal From Deep Trenches, Kaveh Bakhtari, Rasim O. Guldiken, Ahmed A. Busnaina, Jin-Goo Park

Jin-Goo Park

Particle removal from patterned wafers and trenches presents a tremendous challenge in semiconductor manufacturing. In this paper, the removal of 0.3 and 0.8 µm polystyrene latex (PSL) particles from high-aspect-ratio 500 µm deep trenches is investigated. An experimental, analytical, and computational study of the removal of submicrometer particles at different depths inside the trench is presented. Red fluorescent polystyrene latex (PSL) particles were used to verify particle removal. The particles are counted using scanning fluorescent microscopy. A single-wafer megasonic tank is used for the particle removal. The results show that once a particle is removed from the walls or the …