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Articles 1 - 5 of 5
Full-Text Articles in Nanoscience and Nanotechnology
The Effect Of Frictional And Adhesion Forces Attributed To Slurry Particles On The Surface Quality Of Polished Copper, Yi-Koan Hong, Ja-Hyung Han, Tae-Gon Kim, Jin-Goo Park, Ahmed A. Busnaina
The Effect Of Frictional And Adhesion Forces Attributed To Slurry Particles On The Surface Quality Of Polished Copper, Yi-Koan Hong, Ja-Hyung Han, Tae-Gon Kim, Jin-Goo Park, Ahmed A. Busnaina
Ahmed A. Busnaina
The effect of frictional and adhesion forces attributed to slurry particles on the quality of copper surfaces was experimentally investigated during copper chemical mechanical planarization process. The highest frictional force of 9 Kgf and adhesion force of 5.83 nN were observed in a deionized water-based alumina slurry. On the other hand, the smallest frictional force of 4 Kgf and adhesion force of 0.38 nN were measured in an alumina slurry containing citric acid. However, frictional (6 Kgf) and adhesion (1 nN) forces of silica particles in the slurry were not significantly changed regardless of the addition of citric acid. These …
The Effect Of Frictional And Adhesion Forces Attributed To Slurry Particles On The Surface Quality Of Polished Copper, Yi-Koan Hong, Ja-Hyung Han, Tae-Gon Kim, Jin-Goo Park, Ahmed A. Busnaina
The Effect Of Frictional And Adhesion Forces Attributed To Slurry Particles On The Surface Quality Of Polished Copper, Yi-Koan Hong, Ja-Hyung Han, Tae-Gon Kim, Jin-Goo Park, Ahmed A. Busnaina
Ahmed A. Busnaina
The effect of frictional and adhesion forces attributed to slurry particles on the quality of copper surfaces was experimentally investigated during copper chemical mechanical planarization process. The highest frictional force of 9 Kgf and adhesion force of 5.83 nN were observed in a deionized water-based alumina slurry. On the other hand, the smallest frictional force of 4 Kgf and adhesion force of 0.38 nN were measured in an alumina slurry containing citric acid. However, frictional (6 Kgf) and adhesion (1 nN) forces of silica particles in the slurry were not significantly changed regardless of the addition of citric acid. These …
Alloy Solute Interactions At Grain Boundaries And Nanoscale Interfaces In Copper, Luke Prestowitz
Alloy Solute Interactions At Grain Boundaries And Nanoscale Interfaces In Copper, Luke Prestowitz
Nanoscale Science & Engineering (discontinued with class year 2014)
To study grain boundary solute interactions we have developed recipes for co-electrodeposition of dilute copper alloys including Cu(Ni) and Cu(Co). Secondary Ion Mass Spectrometry (SIMS) was used to analyze the incorporation of solute into the copper film. In addition to the co-electrodeposition process we also used a drive-in diffusion model for Au, Ag, Co, and Ni. Atomic imaging in a scanning transmission electron microscope (STEM) was used to visualize and investigate solute at grain boundaries and interfaces in polygranular copper films. By understanding these interactions and pathways of alloying solutes in copper microstructures, we can more accurately predict alloying behavior …
Collaborative Research: A Nanostructure Sensor For Measuring Dissolved Iron And Copper Concentrations In Coastal And Offshore Seawater, Mark Wells, Carl Tripp
Collaborative Research: A Nanostructure Sensor For Measuring Dissolved Iron And Copper Concentrations In Coastal And Offshore Seawater, Mark Wells, Carl Tripp
University of Maine Office of Research Administration: Grant Reports
Iron and Copper serve as key co-constituents for numerous enzymes in a wide range of biological systems, and their elevated or impoverished levels in aqueous systems have dramatic consequences at organismal, ecosystem, and human health scales. Over the last decade these effects have increasingly been recognized to be important in ocean systems. Identifying sites and times where these metals cause negative environmental outcomes is greatly hampered by their comparatively sparse datasets. This problem is a direct consequence of the analytical challenge of obtaining accurate Fe and Cu determinations in saline waters at very low (trace) concentrations, and the limitations of …
The Impact Of Seed Layer Structure On The Recrystallization Of Ecd Cu And Its Alloys, Brendan B. O'Brien
The Impact Of Seed Layer Structure On The Recrystallization Of Ecd Cu And Its Alloys, Brendan B. O'Brien
Legacy Theses & Dissertations (2009 - 2024)
Despite the significant improvements originally offered by the use of Cu over Al as the interconnect material for semiconductor devices, the continued down-scaling of interconnects has presented significant challenges for semiconductor engineers. As the metal line widths shrink, both the conductivity and reliability of lines decrease due to a stubbornly fine-grained microstructure in narrow lines.