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Nanoscience and Nanotechnology Commons

Open Access. Powered by Scholars. Published by Universities.®

2010

Purdue University

Copper; diffusion; interconnections; nanoparticles; silver; transmission electron microscopy

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Full-Text Articles in Nanoscience and Nanotechnology

Fabrication Of Conductive Interconnects By Ag Migration In Cu-Ag Core-Shell Nanoparticles, Suk Jun Kim, E A. Stach, Carol A. Handwerker Apr 2010

Fabrication Of Conductive Interconnects By Ag Migration In Cu-Ag Core-Shell Nanoparticles, Suk Jun Kim, E A. Stach, Carol A. Handwerker

Birck and NCN Publications

Fabrication of conductive nanoparticle films is observed in Cu-Ag core-shell nanoparticles by fast diffusion of Ag at 220 degrees C from particle surfaces, leading to the formation of sintered necks of Ag at the initial particle-particle contacts. Transmission electron microscopy showed that the necks were pure Ag and that particle surfaces away from the contacts were nearly Ag-free. The extent of neck formation is controllable by the choice of initial Ag thickness. Analysis of the thermodynamics of the Ag-Cu system and the relative diffusivities of Ag and Cu provide criteria for fabrication of other core-shell two-phase systems by the same …