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Magnetoresistance Of A Low-K Dielectric, Brian Thomas Mcgowan
Magnetoresistance Of A Low-K Dielectric, Brian Thomas Mcgowan
Legacy Theses & Dissertations (2009 - 2024)
Low-k dielectrics have been incorporated into advanced computer chip technologies as a part of the continuous effort to improve computer chip performance. One drawback associated with the implementation of low-k dielectrics is the large leakage current which conducts through the material, relative to silica. Another drawback is that the breakdown voltage of low-k dielectrics is low, relative to silica [1]. This low breakdown voltage makes accurate reliability assessment of the failure mode time dependent dielectric breakdown (TDDB) in low-k dielectrics critical for the successful implementation of these materials. The accuracy with which one can assess this reliability is currently a …
Texture And Microstructure Of Ipvd Copper Manganese Seed In 1 Μm & 70 Nm Wide Damascene Trenches, Robert Stuart Brown
Texture And Microstructure Of Ipvd Copper Manganese Seed In 1 Μm & 70 Nm Wide Damascene Trenches, Robert Stuart Brown
Legacy Theses & Dissertations (2009 - 2024)
This thesis describes the grain texture and microstructure of Ionized Physical Vapor Deposition (iPVD) Copper Manganese seed in 1 µm and 70 nm wide damascene trenches. Using Transmission Electron Microscopy (TEM) imaging and diffraction pattern analysis, the grain size and general orientation of the grains were determined. It was found that the 1 µm wide trenches contained larger grains and more texture than that of the 70 nm wide trenches. While this thesis builds upon previous work by Brendan O’Brien in the Dunn group, one significantly different finding will be presented regarding the structure on the sidewall of the trenches. …