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Full-Text Articles in Nanoscience and Nanotechnology
Research Progresses Of Copper Interconnection In Chips, Lei Jin, Jia-Qiang Yang, Fang-Zu Yang, Dong-Ping Zhan, Zhong-Qun Tian, Shao-Min Zhou
Research Progresses Of Copper Interconnection In Chips, Lei Jin, Jia-Qiang Yang, Fang-Zu Yang, Dong-Ping Zhan, Zhong-Qun Tian, Shao-Min Zhou
Journal of Electrochemistry
In this paper, the copper interconnection technology in chip manufacturing is introduced in detail, and the essentials of acidic copper sulfate electroplating process and the mechanisms of common-used additives are reviewed. The progresses of novel additives at home and abroad are also summarized. Based on the studied achievement, the possibility of the novel copper interconnect process replacing the acidic copper electroplating is prospected.