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Full-Text Articles in Nanoscience and Nanotechnology
Mechanism And Application Of Nickel Nano-Cone By Electrodeposition On A Flexible Substrate, Xiu-Ren Ni, Ya-Ting Zhang, Chong Wang, Yan Hong, Yuan-Ming Chen, Yuan-Zhang Su, Wei He, Xian-Ming Chen, Ben-Xia Huang, Zhen-Lin Xu, Yi-Feng Li, Neng-Bin Li, Yong-Jie Du
Mechanism And Application Of Nickel Nano-Cone By Electrodeposition On A Flexible Substrate, Xiu-Ren Ni, Ya-Ting Zhang, Chong Wang, Yan Hong, Yuan-Ming Chen, Yuan-Zhang Su, Wei He, Xian-Ming Chen, Ben-Xia Huang, Zhen-Lin Xu, Yi-Feng Li, Neng-Bin Li, Yong-Jie Du
Journal of Electrochemistry
Nano-array structure possesses promising prospect in power supply, optical device and electronic manufacturing. In this paper, a black nickel nano-cone array was prepared on a flexible substrate by galvanostatic deposition and the corresponding factors involved in the fabrication of nickel nano-cone array was explored. Experimental results showed that a large current density and low main salt concentration were not favored to the formation of cone nickel structure. It was also found that ammonium chloride, as the crystal modifier, was crucial to deposit the uniform nano-cone array. In addition, the growth mechanism of nickel nano-cone was further studied by molecular dynamics …
Research Progresses Of Cobalt Interconnect And Superfilling By Electroplating In Chips, Li-Jun Wei, Zi-Han Zhou, Yun-Wen Wu, Ming Li, Su Wang
Research Progresses Of Cobalt Interconnect And Superfilling By Electroplating In Chips, Li-Jun Wei, Zi-Han Zhou, Yun-Wen Wu, Ming Li, Su Wang
Journal of Electrochemistry
Copper interconnect using dual damascene technology has always been the main means for metallization in the back end of line process. However, with the size effect becoming more and more obvious due to feature size reduction, copper interconnect can no longer meet the demand for high circuit speed in Post-Moore era. Following copper interconnection, cobalt interconnection in chips attracts much attention as an interconnect technology by the next generation, which has been introduced in 7 nm node of integrated circuit manufacturing and below. The electron mean free path of cobalt (~10 nm) is much shorter than copper’s (39 nm), thus …