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High Frequency Signal Transmission In Through Silicon Via Based 3d Integrated Circuit, Min Xu
High Frequency Signal Transmission In Through Silicon Via Based 3d Integrated Circuit, Min Xu
Legacy Theses & Dissertations (2009 - 2024)
Through silicon vias (TSVs) enable 3-dimensional (3D) integrated circuits (ICs), which have the potential to reduce the power consumption, interconnect length and overall communication latency in modern nanoelectronics systems. High-speed signal transmission channels through stacked silicon substrates are critical for 3D heterogeneous integration. This work presents systematic analyses of fabricated 3D IC test structures. This includes test structure design, fabrication, experimental characterization, equivalent circuit modeling and full wave simulations for high-speed signal transmission of the TSV based 3D IC channels.