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The Impact Of Seed Layer Structure On The Recrystallization Of Ecd Cu And Its Alloys, Brendan B. O'Brien
The Impact Of Seed Layer Structure On The Recrystallization Of Ecd Cu And Its Alloys, Brendan B. O'Brien
Legacy Theses & Dissertations (2009 - 2024)
Despite the significant improvements originally offered by the use of Cu over Al as the interconnect material for semiconductor devices, the continued down-scaling of interconnects has presented significant challenges for semiconductor engineers. As the metal line widths shrink, both the conductivity and reliability of lines decrease due to a stubbornly fine-grained microstructure in narrow lines.