Mechanical Engineering Commons^™

Vibration Fatigue Of Leaded Solder Joint Interconnects For Pcb Electronics, John Crowder

All Theses

With the increasing prevalence of electronic equipment worldwide, there is also a decrease in the size of the components on their printed circuit boards (PCBs), leading to an increase in the density of these components. A significant amount of failure in electronic equipment is vibration fatigue of solder joints and their attachments. However, the complexity of these PCBs and their components has made finite element modeling (FEM) more complex, adding considerable time to create and analyze a model.

This paper aims to provide a literature review for the vibration fatigue of leaded solder components, create a test setup, and validate …