Open Access. Powered by Scholars. Published by Universities.®
Articles 1 - 1 of 1
Full-Text Articles in Mechanical Engineering
Effect Of Gold Content On The Reliability Of Snagcu Solder Joints, Jianbiao Pan, J. Silk, M. Powers, P. Hyland
Effect Of Gold Content On The Reliability Of Snagcu Solder Joints, Jianbiao Pan, J. Silk, M. Powers, P. Hyland
Jianbiao Pan
Electroplated Ni/Au over Cu is a popular metallization for printed circuit board finish as well as for component leads, especially wire-bondable high-frequency packages, where the gold thickness requirement for wire bonding is high. The general understanding is that less than 3 wt% of Au is acceptable in SnPb solder joints. However, little is known about the effect of Au content on the reliability of SnAgCu solder joints. The purpose of this paper is to determine the acceptable level of Au in SAC305 solder joints. Three different package platforms with different Au thicknesses were assembled on boards with two different Au …