Mechanical Engineering Commons^™

Thermal Modeling And Laser Beam Shaping For Microvias Drilling In High Density Packaging, Chong Zhang

Electronic Theses and Dissertations

Laser drilling of microvias for organic packaging applications is studied in present research. Thermal model is essential to understand the laser-materials interactions and to control laser drilling of blind micro holes through polymeric dielectrics in multilayer electronic substrates. In order to understand the profile of the drilling front irradiated with different laser beam profiles, a transient heat conduction model including vaporization parameters is constructed. The absorption length in the dielectric is also considered in this model. Therefore, the volumetric heating source criteria are applied in the model and the equations are solved analytically. The microvia drilling speed, temperature distribution in …