Open Access. Powered by Scholars. Published by Universities.®
- Institution
- Publication
Articles 1 - 2 of 2
Full-Text Articles in Mechanical Engineering
Experimental Characterization Of Cu Free-Air Ball And Simulations Of Dielectric Fracture During Wire Bonding, Sai Sudharsanan Paranjothy
Experimental Characterization Of Cu Free-Air Ball And Simulations Of Dielectric Fracture During Wire Bonding, Sai Sudharsanan Paranjothy
Open Access Theses
Wire bonding is the process of forming electrical connection between the integrated circuit (IC) and its structural package. ICs made of material with low dielectric constant (low-k) and ultra low-k are porous in nature, and are prone to fracture induced failure during packaging process. In recent years, there is increasing interest in copper wire bond technology as an alternative to gold wire bond in microelectronic devices due to its superior electrical performance and low cost. Copper wires are also approximately 25% more conductive than Au wires aiding in better heat dissipation. At present, validated constitutive models for the strain rate …
Applications Of The Variational Approach To Fracture Mechanics, Ataollah Mesgarnejad
Applications Of The Variational Approach To Fracture Mechanics, Ataollah Mesgarnejad
LSU Doctoral Dissertations
In this study we present the variational approach to fracture mechanics as a versatile tool for the modeling of the fracture phenomenon in solids. Variational fracture mechanics restates the problem of initiation and propagation of cracks in solids as an energy minimization problem. The edifice of this energy minimization problem is such that unlike other methods (e.g. extended finite element method XFEM, cohesive-zone methods) the variational approach to fracture mechanics, diminishes the need for an a priori knowledge of the crack path or ad hoc assumptions in the form of path selection laws. We will show applications of the variational …