Mechanical Engineering Commons^™

Capabilities Of Sintered Silver As A High Temperature Packaging Material, Bakhtiyar Mohammad Nafis

Graduate Theses and Dissertations

With electrification progressing across many sectors including industry, automotive and aerospace, the power density requirements are changing. The increased power density results in higher and higher ambient temperatures that electronics are exposed to. The response has been to move towards wide bandgap (WBG) semiconductor devices that can withstand much greater temperatures and can operate at much higher voltages than silicon. Additionally, these WBG devices deliver low drain-source on resistance (RDS_on) capabilities, enabling high current power modules that increase power density even further. This also requires the packaging to evolve in order to withstand the new requirements. As a result, researchers …