Mechanical Engineering Commons^™

Mechanical And Frictional Behavior Of Textured And Non-Textured Surfaces, Raghuram R. Santhapuram

Graduate Theses and Dissertations

Tribology is the study of surfaces where two objects are sliding against another. Significant energy is lost due to friction between the sliding surfaces. Therefore, developing or designing surfaces to minimize friction is critical for the durability and reliability of the mechanical components. Several researchers have identified that surface texturing at the nanoscale (nanotexture) would reduce the friction between the contacting surfaces. The nanotextured surfaces have several applications in microelectromechanical systems and nanoelectromechanical systems. This dissertation employs molecular dynamics simulations to investigate the frictional and mechanical response of nanotextured aluminum (Al) and Al/amorphous silicon (a-Si) composite surfaces.

This study determines …

Adhesion And Deformation Mechanisms Of Polydopamine And Polytetrafluoroethylene: A Multiscale Computational Study, Matthew Brownell

Graduate Theses and Dissertations

Polydopamine (PDA) has been shown to bond via covalent bonding, van der Waals forces, and hydrogen bonding and is known to adhere strongly to almost any material. The application of PDA between a substrate and a PTFE surface coating has resulted in low friction and a greatly reduced wear rate. Previous research probing the capabilities and limitations of PDA/PTFE films have studied the wear and mechanical properties of the film, but the overall adhesive and deformation mechanisms remain unclear.

In this research, we investigate the tribological properties of PDA and PTFE molecules and composites from the atomic to the microscale …

Design, Fabrication, And Reliability Effects Of Additively Manufactured First Level Compliant Interconnects For Microelectronics Application, Tumininu David Olatunji

Graduate Theses and Dissertations

Semiconductor packaging and development is greatly dependent on the magnitude of interconnect and on-chip stress that ultimately limits the reliability of electronic components. Thermomechanical related strains occur because of the coefficient of thermal expansion mismatch from different conjoined materials being assembled to manufacture a device. To curb the effect of thermal expansion mismatch between conjoined parts, studies have been done in integrating compliant structures between dies, solder balls, and substrates. Initial studies have enabled the design and manufacturing of these structures using a photolithography approach which involves a high number of fabrication steps depending on the complexity of the structures …

Enhancement Of Phase Change Material Sorbitol By Nanoparticle Inclusion For Improving Thermal Energy Storage Capabilities, Joshua Kasitz

Mechanical Engineering Undergraduate Honors Theses

Thermal management of electronic devices has become an increasingly vital field of study with the rapid miniaturization of many key electrical components. With the significant improvement of semiconductor manufacturing and intensified focus on interconnects, electronic devices have decreased in size at an incredible rate. Decreasing spatial requirements is essential to improving device capabilities as the electronic system is able to incorporate more components. Currently, electronic systems are drastically limited by the capabilities of their cooling mechanisms. Smaller devices lead to large increases in the energy density of the system and require more powerful cooling systems to maintain proper component operating …