Mechanical Engineering Commons^™

Combined Stressors In Reliability Failure Modes In Flip-Chip Electronic Packaging, Mahsa Montazeri

Graduate Theses and Dissertations

The trend toward miniaturization of electronic devices to fulfill Moore’s law introduces new reliability concerns to the electronic packaging process while worsening existing primary challenges. In solder interconnect specifically, temperature cycling is one of the prominent failure threats. However, with further downscaling of the flip-chip solder connections, electromigration also present a precarious failure mode in these interconnects. On the other hand, understanding the degradation mechanism in solders is crucial for the power electronic products' reliability considering the industrial tendency to replace wirebonds with solder attachment while improving the current carry capacity. This dissertation utilizes FEA simulation and an experimental approach …

Design, Fabrication, And Reliability Effects Of Additively Manufactured First Level Compliant Interconnects For Microelectronics Application, Tumininu David Olatunji

Graduate Theses and Dissertations

Semiconductor packaging and development is greatly dependent on the magnitude of interconnect and on-chip stress that ultimately limits the reliability of electronic components. Thermomechanical related strains occur because of the coefficient of thermal expansion mismatch from different conjoined materials being assembled to manufacture a device. To curb the effect of thermal expansion mismatch between conjoined parts, studies have been done in integrating compliant structures between dies, solder balls, and substrates. Initial studies have enabled the design and manufacturing of these structures using a photolithography approach which involves a high number of fabrication steps depending on the complexity of the structures …

Exploring Convergence Of Snake Skin-Inspired Texture Designs And Additive Manufacturing For Mechanical Traction, Catherine Sue Tiner

Graduate Theses and Dissertations

This research focuses on the understanding, development, and additive manufacture of a 3D printed snake skin-inspired texture pattern. The design functionalities of snake skin were determined through the study of the snake species Python Regius otherwise known as the ball python. Each scale of a snake has hierarchical texture with hexagonal macro-patterns aligned on the ventral surface of the skin with overriding anisotropic micro textured patterns such as denticulations and fibrils. Using a laser-powder bed fusion (L-PBF) process, 420 stainless steel samples were 3D printed which closely resemble the above described directional texture of natural snake skin. This printed surface …

Fault Adaptive Workload Allocation For Complex Manufacturing Systems, Charlie B. Destefano

Graduate Theses and Dissertations

This research proposes novel fault adaptive workload allocation (FAWA) strategies for the health management of complex manufacturing systems. The primary goal of these strategies is to minimize maintenance costs and maximize production by strategically controlling when and where failures occur through condition-based workload allocation.

For complex systems that are capable of performing tasks a variety of different ways, such as an industrial robot arm that can move between locations using different joint angle configurations and path trajectories, each option, i.e. mission plan, will result in different degradation rates and life-expectancies. Consequently, this can make it difficult to predict when a …

Development Of A Rapid Fatigue Life Testing Method For Reliability Assessment Of Flip-Chip Solder Interconnects, Cody Jackson Marbut

Graduate Theses and Dissertations

The underlying physics of failure are critical in assessing the long term reliability of power packages in their intended field applications, yet traditional reliability determination methods are largely inadequate when considering thermomechanical failures. With current reliability determination methods, long test durations, high costs, and a conglomerate of concurrent reliability degrading threat factors make effective understanding of device reliability difficult and expensive. In this work, an alternative reliability testing apparatus and associated protocol was developed to address these concerns; targeting rapid testing times with minimal cost while preserving fatigue life prediction accuracy. Two test stands were fabricated to evaluate device reliability …

A Numerical Investigation Of Bio-Inspired Scaffolds And Surface Textures, Yucong Gu

Graduate Theses and Dissertations

Synthetic scaffolds are widely used as implants to repair bone fracture. Without a proper design, scaffolds could pose significant health risks to the patient and fail to heal the bone properly. A good synthetic scaffold needs to have high porosity and large pore size to allow new bone cells to form on it. However, a scaffold with higher porosity and larger pore size tends to have reduced mechanical strength. Thus, it is important to find a structural design which allows the implant to have a high porosity and large pore size while retaining high strength. In this research, a 3D-printable …

Selective Resistive Sintering: A Novel Additive Manufacturing Process, Austin Bryan Van Horn

Graduate Theses and Dissertations

Selective laser sintering (SLS) is one of the most popular 3D printing methods that uses a laser to pattern energy and selectively sinter powder particles to build 3D geometries. However, this printing method is plagued by slow printing speeds, high power consumption, difficulty to scale, and high overhead expense. In this research, a new 3D printing method is proposed to overcome these limitations of SLS. Instead of using a laser to pattern energy, this new method, termed selective resistive sintering (SRS), uses an array of microheaters to pattern heat for selectively sintering materials. Using microheaters offers significant power savings, significantly …

The Effect Of Process Parameters And Surface Condition On Bond Strength Between Additively Manufactured Components And Polymer Substrates, Bharat Bhushan Chivukula

Graduate Theses and Dissertations

Additive patching is a process in which printers with multiple axes deposit molten material onto a pre-defined surface to form a bond. Studying the effect of surface roughness and process parameters selected for printing auxiliary part on the bond helps in improving the strength of the final component. Particularly, the influence of surface roughness, as established by adhesion theory, has not been evaluated in the framework of additive manufacturing (AM). A full factorial design of experiments with five replications was conducted on two levels and three factors, viz., layer thickness, surface roughness, and raster angle to examine the underlying effects …

Design, Fabrication, And Testing Of A 3d Printer Based Microfluidic System, Carlton A. Mcmullen

Graduate Theses and Dissertations

A pneumatically actuated PDMS based microfluidic devices were designed and fabricated by soft-lithography. Two types of molds were fabricated out of different material for this experiment. The first mold, (device 1), was fabricated from a sheet of Polymethyl methacrylate (PMMA) material, similar to Plexiglas. The device features were micro-engraved onto the face of the material. The second mold, (device 2), was fabricated from the use of fused deposition modeling (FDM) 3D printing. The pumping efficiency of the PDMS devices was analyzed through the characterization of the micro-pumps flowrate with respect to the pumps driving pressure and the actuation frequency. Tested …