Open Access. Powered by Scholars. Published by Universities.®
Articles 1 - 3 of 3
Full-Text Articles in Mechanical Engineering
Thermal Resistance Characterization Of High-Voltage Sic Power Module, Landon Lemmons
Thermal Resistance Characterization Of High-Voltage Sic Power Module, Landon Lemmons
Mechanical Engineering Undergraduate Honors Theses
Researchers within the University of Arkansas Electrical Engineering Research Department have embarked on a project aimed at enhancing the thermal performance of high-voltage power modules. To aid in the progress of this project, the design, and development of a thermal tester device are needed. The primary objective of this device is to determine the various thermal properties of high-voltage power modules that the electrical engineering department has developed. Additionally, the project aims to facilitate electrical loading tests on power modules and provide researchers with the means to calibrate the power module in terms of thermal load. This project also possesses …
Nonmetallic Jet Impingement Thermal Management For Power Electronics Via Additive Manufacturing, Reece Whitt
Nonmetallic Jet Impingement Thermal Management For Power Electronics Via Additive Manufacturing, Reece Whitt
Graduate Theses and Dissertations
The increase in energy demanded by transportation and energy sectors has necessitated highly efficient thermal management for reliable power electronics operations. Conventional cooling techniques are limited by their inability to target switching location hot spot temperatures, leading to non-uniform thermal gradients. These devices, such as cold plates and heat sinks, also utilize heavy metallic structures that can accentuate electromagnetic interferences generated by high voltage switching processes. This work proposes a non-metallic jet impingement cooler for more customized thermal management, while simultaneously reducing the harmful effects of electromagnetic interferences. Additive manufacturing is utilized to enable jet impingement zones to target individual …
Mission Profile Effects On Automotive Drivetrain Electronics Reliability: Modeling And Mitigation, Bakhtiyar Mohammad Nafis
Mission Profile Effects On Automotive Drivetrain Electronics Reliability: Modeling And Mitigation, Bakhtiyar Mohammad Nafis
Graduate Theses and Dissertations
The reliability of electronic devices is dependent upon the conditions to which they are subject. Temperature variations coupled with differences in thermal expansion between bonded materials results in thermomechanical stresses to build up, which can instigate failure in the interconnects or other critical regions. With the move towards electrification in the automotive industry, there is the increasingly important consideration of powertrain electronics reliability, the pertinent conditions being governed by the drive cycle or mission profile of the vehicle. The mission profile determines the power dissipated by the electronic devices, which determines the peak and mean temperature, temperature swing and the …