Mechanical Engineering Commons^™

Design And Control Of A Peristaltic Pump To Simulate Left Atrial Pressure In A Conductive Silicone Model, Jeremy Collins

Mechanical Engineering Undergraduate Honors Theses

According to the CDC, atrial fibrillation is responsible for more than 454,000 hospitalizations and approximately 158,000 deaths per year. A common treatment for atrial fibrillation is catheter ablation, a process in which a long flexible tube is guided through the femoral artery and to the source of arrhythmia in the heart, where it measures the electrical potential at various locations and converts problematic heart tissue to scar tissue via ablation. This paper details the design and control of a low-cost ($400) peristaltic pump system using repetitive control to replicate blood pressure in the left atrium in a conductive silicone model …

Methods To Remotely Eliminate Biofilm From Medical Implants Using 2.4 Ghz Microwaves, Brett Glenn

Mechanical Engineering Undergraduate Honors Theses

Infections associated with biofilm growth are usually challenging to eradicate due to their high tolerance toward antibiotics [11, 12]. Biofilms often form on the inert surfaces of medically implanted devices [13]. No matter the sophistication, microbial infections can develop on all medical devices and tissue engineering constructs [12]. Related infections lead to 2 million cases annually in the U.S., costing the healthcare system over $5 billion in additional healthcare expenses [12].

Novel solutions to biofilm’s microbial colonization span the spectrum of engineering and science disciplines. Yet a practical solution still does not exist. The research presented here will explore a …

Bgaas Alloy Semiconductors For Lasers On Silicon, Joshua Mcarthur

Mechanical Engineering Undergraduate Honors Theses

In the world of semiconductors today, there is a large dissonance between optical devices and electrical application. Due to the limitations of electron transport, photonic integrated circuits are soon-to-be vital in fields like telecommunications and sensing. Right now, these PIC’s are mostly made from indium phosphide. Due to its ubiquitous nature, however, there is a huge push to integrate efficient optics with silicon. It’s cheap, abundant, dope-able, and our electronic infrastructure is based on it. The reason why silicon photonics aren’t already commercialized is because of silicon’s indirect bandgap—it is inefficient with optical applications. The problem with combining direct gap …

Chip-Package Interfacial Stress Analysis And Reliability Implications For Flip-Chip Power Devices, Jonathan Gh Treco

Mechanical Engineering Undergraduate Honors Theses

The solder in flip-chip assemblies experience high stress and strain because of thermal mismatch induced deformation. These deformations occur because of the differences of coefficient of thermal expansion between flip-chip assembly materials. The similarly in stress profiles between thermal induced and shear induced stress in solder joints enable the use of die shear testing as a representative technique for relating the max stress the flip-chip can withstand to cyclic thermal fatigue failures. In this work, two electronic device sample preparation types are evaluated: One set of samples are soldered together and other set of samples use epoxy as an adhesive. …

System-Layout-Dependent Thermally Induced Solder Stress & Reliability Implications, Ange C. Iradukunda

Mechanical Engineering Undergraduate Honors Theses

Electronic flip chip assemblies consist of dissimilar component materials, which exhibit different CTE. Under thermal cyclic operating conditions, this CTE mismatch produces interfacial and interconnect stresses, which are highly dependent on system layout. In this paper, sensitivity analyses are performed using ANSYS FEA to establish how the proximity and arrangement of neighboring devices affect interconnect stress. Flip chip alignment modes ranging from edge-to-edge to corner-to-corner are studied. Results of these FEA studies, demonstrated that closely packing devices together has the effect of making them act as one. This results in a significant increase in the thermomechanical stresses induced on peripheral …

Optimization Of Reduced Graphene Oxide Deposition For Hydrogen Sensing Technologies, Matthew Pocta

Mechanical Engineering Undergraduate Honors Theses

Graphene is known to be a key material for improving the performance of hydrogen sensors. High electrical conductivity, maximum possible surface area with respect to volume, and high carrier mobility are a few of the properties that make graphene ideal for hydrogen sensing applications. The problem with utilizing graphene is the difficulty in depositing uniform, thin layers onto substrate surfaces. This study examines a new method of optimizing graphene deposition by utilizing an airbrush to deposit both graphene oxide (GO) and reduced graphene oxide (rGO) onto glass substrates. The number of depositions were varied among samples to study the effect …

Industrial Energy Consumption, Benchmarking, And Analysis In The United States, Daniel Maldonado

Mechanical Engineering Undergraduate Honors Theses

The purpose of this paper is to analyze the energy consumption of the industrial sector in the United States, and to identify the tools that can be used to minimize the consumption and improve the energy efficiency of all facilities in the country. The first part of the paper is a historical analysis of the industrial sector energy consumption, where the different energy sources are identified. The second part details different electronic tools that will provide facilities the ability of performing benchmarking, in order to understand their energy performance. Finally, the third part of this paper provides information about the …

A Review Of Variable Valve Timing Devices, Paul Shelton

Mechanical Engineering Undergraduate Honors Theses

Variable valve timing (VVT) has evolved from simple, manual controlled engine management to automatic, electronic works of engineering. Starting from the need for more power and extending into fuel efficiency and low emissions, VVT has evolved from the constant changing of needs. This paper summarizes various devices used to control the timing of valves from the early 1920s up until 2007.