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Understanding The Effects Of Addition Of Copper Nanoparticles To Sn-3.5 Ag Solder
Understanding The Effects Of Addition Of Copper Nanoparticles To Sn-3.5 Ag Solder
A.S. Md Abdul Haseeb
Purpose - The purpose of this paper is to focus on the fabrication of SAC nanocomposites solder and discuss the effects of nanoCu addition on the structure and properties of resulted nanocomposite solder. Design/methodology/ approach - Ball milling is a nonequilibrium processing technique for producing composite metal particles with submicron homogeneity by the repeated cold welding and fracture of powder particles. This method is believed to offer good processablity, precise control over the solder composition, and produce more homogeneous mixture. Findings - It is found that the melting temperature, the wetting behaviour, and hardness are improved when the Cu nanoparticles …