Open Access. Powered by Scholars. Published by Universities.®
Articles 1 - 2 of 2
Full-Text Articles in Mechanical Engineering
Electrodeposition Of Lead-Free Solder Alloys
Electrodeposition Of Lead-Free Solder Alloys
A.S. Md Abdul Haseeb
Purpose - The purpose of this paper is to enhance the understanding on the electrodeposition of various lead (Pb)-free solder alloys, so that new studies can be carried out to solve processing issues. Design/methodology/approach - The paper reviews the available reports on the electrodeposition of tin (Sn)-based solder systems and identifies the challenges in this area. Findings - Compositional control remains a major challenge in this area, where the achievement of desired composition for binary and ternary alloys is subjected to uncertainties. The use of chelating agents in the bath and optimization of parameters can assist the achievement of near-desired …
Failure Analysis Of Superheater Tube Supports Of The Primary Reformer In A Fertilizer Factory
Failure Analysis Of Superheater Tube Supports Of The Primary Reformer In A Fertilizer Factory
A.S. Md Abdul Haseeb
Eutectic Sn-Bi alloy is gaining considerable attention in the electronic packaging industry because of its favorable properties such as low melting temperature, good wettability, and good mechanical properties. Miniaturization of electronic devices requires small solder bumps, a few tens of micrometers in diameter. Electrodeposition is a reliable technique for the deposition of small volume of solder. This work focuses on the formation of eutectic Sn-Bi solder by reflowing a metal stack containing sequentially electrodeposited Sn and Bi layers. The effects of layering sequence on the composition and microstructure of the resulting alloy is investigated. Irrespective of the layering sequence, a …