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Full-Text Articles in Mechanical Engineering
Influence Of Ni Nanoparticle On The Morphology And Growth Of Interfacial Intermetallic Compounds Between Sn-3.8ag-0.7cu Lead-Free Solder And Copper Substrate
A.S. Md Abdul Haseeb
This paper reports on the effects of adding Ni nanoparticles to a Sn-3.8Ag-0.7Cu solder. The nanocomposite was prepared by manual blending of SAC solder paste with various percentages of Ni particles. Results showed that the addition of Ni nanoparticles did not bring any significant change in the onset melting temperature of the solder. An increase in the weight percentage of nanoparticles in the solder caused an increase of the wetting angle and a decrease of spreading rate. Moreover, the addition of Ni nanoparticles changed the interfacial intermetallic compound morphology from a scalloped structure into a planar type structure, enhanced the …
Nanoindentation And Micro-Mechanical Fracture Toughness Of Electrodeposited Nanocrystalline Ni-W Alloy Films
A.S. Md Abdul Haseeb
Nanocrystalline nickel-tungsten alloys have great potential in the fabrication of components for microelectromechanical systems. Here the fracture toughness of Ni-12.7 at.%W alloy micro-cantilever beams was investigated. Micro-cantilevers were fabricated by UV lithography and electrodeposition and notched by focused ion beam machining. Load was applied using a nanoindenter and fracture toughness was calculated from the fracture load. Fracture toughness of the Ni-12.7 at.%W was in the range of 1.49-5.14 MPa √m. This is higher than the fracture toughness of Si (another important microelectromechanical systems material), but considerably lower than that of electrodeposited nickel and other nickel based alloys. © 2012 Elsevier …
Nanoindentation And Micro-Mechanical Fracture Toughness Of Electrodeposited Nanocrystalline Ni-W Alloy Films
A.S. Md Abdul Haseeb
Nanocrystalline nickel-tungsten alloys have great potential in the fabrication of components for microelectromechanical systems. Here the fracture toughness of Ni-12.7 at.%W alloy micro-cantilever beams was investigated. Micro-cantilevers were fabricated by UV lithography and electrodeposition and notched by focused ion beam machining. Load was applied using a nanoindenter and fracture toughness was calculated from the fracture load. Fracture toughness of the Ni-12.7 at.%W was in the range of 1.49-5.14 MPa √m. This is higher than the fracture toughness of Si (another important microelectromechanical systems material), but considerably lower than that of electrodeposited nickel and other nickel based alloys. © 2012 Elsevier …
Structural Investigations On Nanocrystalline Ni-W Alloy Films By Transmission Electron Microscopy
Structural Investigations On Nanocrystalline Ni-W Alloy Films By Transmission Electron Microscopy
A.S. Md Abdul Haseeb
Electrodeposited Ni-W alloys have been investigated in the as-deposited state by transmission electron microscopy in order to investigate the microstructural features in dependence of the tungsten content. Within the tungsten content range from 7 at.% up to 12 at.%, the microstructure is nanocrystalline characterized by a bimodal grain size distribution, consisting out of 20 to 200 nm sized grains and also larger grains with several 100 nm characteristic dimension. No clear trend in microstructure formation is visible with W content or deposition conditions in the investigated W content range. Only solid solution phase characteristics were observed. The lattice constant is …
Thermal Stability Of Electrodeposited Liga Ni-W Alloys For High Temperature Mems Applications
Thermal Stability Of Electrodeposited Liga Ni-W Alloys For High Temperature Mems Applications
A.S. Md Abdul Haseeb
For thermally stable LIGA materials for high temperature MEMS applications LIGA Ni-W layers and micro testing samples with different compositions (15 and 5 at% W) were electrodeposited. In order to investigate the thermal stability the Ni-W layers were annealed at different temperatures (300-700°C) and for different durations (1, 4, 16 h). Their microstructure and micro-hardness were than analysed after annealing and compared with those of as-deposited states. The observed microstructures show, in comparison to pure LIGA nickel, a small grain growth and a relatively stable structure up to 700°C. The micro-hardness values of the LIGA Ni-W layers are higher than …
Modeling Of The Effects Of Athermal Flow Strength And Activation Energy For Dislocation Glide On The Nanoindentation Creep Of Nickel Thin Film At Room Temperature
A.S. Md Abdul Haseeb
Nanoindentation creep behaviour of nickel at room temperature has been modeled based on the obstacle-controlled dislocation glide mechanism. Using the model, the effects of two important materials parameters viz. the activation free energy required by dislocation to overcome an obstacle without any aid from external stress, ΔF and the athermal flow strength, τ0, which is the flow strength of solids at 0 K are systematically studied. It has been found that ΔF plays a dominant role in room temperature creep properties of nickel. The role of ΔF is particularly dominant in determining the time dependent deformation. On the other hand, …
Fretting Wear Of Metallic Multilayer Films
Fretting Wear Of Metallic Multilayer Films
A.S. Md Abdul Haseeb
Fretting wear behaviour of electrodeposited Cu/Ni multilayer films with 10 and 5 nm thick sublayers has been investigated against a hardened steel ball as the counter body and compared with that of the constituents, Cu and Ni. The wear tests were carried out by using a ball-on-flat geometry at a translation frequency of 8 Hz and slip amplitude of 100 μm. Friction force was recorded on line during the tests. At the end of the tests, the wear scars were examined by laser surface profilometry, scanning electron microscopy and energy dispersive X-ray microanalysis. It has been observed that the frictional …