Mechanical Engineering Commons^™

Chemical Mechanical Planarization Of Electronic Materials, Fnu Atiquzzaman

USF Tampa Graduate Theses and Dissertations

In the modern semiconductor manufacturing processes, chemical mechanical planarization (CMP) has attained important processing step because of its ability to provide global planarization. CMP is the planarization technique which is used for the removal of excess material, as left over from the previous processing steps. In addition, CMP offers a uniform surface that is essential for subsequent processing steps, especially for the high resolution photolithography processes. In simpler notation, CMP is a process where a chemical reaction enhances in obtaining a planar surface through removal of the mechanical materials from a wafer.

In this study, CMP performance of three electronic …