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Microstructural Development In A Rapidly Cooled Eutectic Sn–3.5% Ag Solder Reinforced With Copper Powder, D. Lin, T. Srivatsan, Guo-Xiang Wang, R. Kovacevic
Microstructural Development In A Rapidly Cooled Eutectic Sn–3.5% Ag Solder Reinforced With Copper Powder, D. Lin, T. Srivatsan, Guo-Xiang Wang, R. Kovacevic
Dr. Guo-Xiang Wang
Experiments using eutectic Sn–3.5% Ag solder paste were conducted with the objective of examining the conjoint influence of copper particles addition and rapid cooling on microstructural development. The composite solder mixture was made by thoroughly mixing a pre-weighed amount of copper particles with a commercial Sn–3.5% Ag solder paste. The experiments were quite similar to the heating and cooling cycle of an industrial reflow soldering process. Heating of the samples was conducted in a furnace whose temperature was carefully controlled. The cooling process was conducted on a chilled aluminum block through which coolant was circulated at 0.5 °C. When the …