Mechanical Engineering Commons^™

Reliability Of Solder Joints In Embedded Packages Using Finite Element Methods, Valeri Aisha Yunusa

Dissertations and Theses

Solder joints serve as both mechanical and electrical connections between elements in a package. They are subjected to shear strains generated as a result of the different behaviors of the elements in the package (tension and compression) due to the differences in coefficients of thermal expansion during service conditions.

Some of the causes of solder joint failures are due to the following:

Vibration: small rapid displacements of parts of the assembly. This is not necessarily an issue with electronic components but larger parts like automobiles.

Humidity: the package being exposed to water or ionic species can undergo corrosion if an …

Stress Analysis Of Embedded Devices Under Thermal Cycling, Sadhana Radhakrishnan

Dissertations and Theses

Embedded active and passive devices has been increasingly used by in order to integrate more functions inside the same or smaller size device and to meet the need for better electrical performance of the component assemblies.

Solder joints have been used in the electronic industry as both structural and electrical interconnections between electronic packages and printed circuit boards (PCB). When solder joints are under thermal cyclic loading, mismatch in coefficients of thermal expansion (CTE) between the printed circuit boards and the solder balls creates thermal strains and stresses on the joints, which may finally result in cracking. Consequently, the mechanical …